Interconnect Substrate for Multi-Component Package Size Reduction

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Solution Overview

Problem

Conventional multi-component packages become larger and more expensive as the number of discrete components increases due to the need for additional interconnection circuitry, which is undesirable for applications like wireless devices.

Innovation Solution

A method and system for fabricating an interconnect substrate with an insulating base and conductive layers that provides interconnects for discrete components, allowing them to be mounted directly on the die rather than the package substrate, reducing the size and cost of the package.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If discrete components are mounted on the package substrate with separate interconnection circuitry, then connectivity is achieved, but the package size increases

Engineering Contradiction:

ImproveconnectivityVSAvoidpackage size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent merges the interconnection circuitry and discrete component mounting functions into a single integrated substrate. The substrate includes conductive traces that directly connect to discrete components while also providing interconnection to the die, eliminating the need for separate interconnection circuits and reducing overall package size.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves multiple functions simultaneously: it acts as the mounting platform for discrete components, provides interconnection circuitry for signal routing, and enables electrical connection between the die and discrete components. This multi-functionality reduces the number of separate components needed and shrinks the package footprint.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If more discrete components are added to increase functionality, then adaptability improves, but manufacturing cost increases

Engineering Contradiction:

ImprovefunctionalityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple functions into a single substrate structure, reducing the total component count. By integrating interconnection circuits and component mounting functions into one substrate, manufacturing steps are reduced and assembly is simplified, lowering overall manufacturing cost despite increased functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed with segmented functional regions that can be independently optimized. Different areas of the substrate provide different functions (component mounting, signal routing, power distribution), allowing for efficient layout and reduced material usage, which helps control manufacturing costs.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS7821122B2Method and system for increasing circuitry interconnection and component capacity in a multi-component package

Publication Date: 2010.10.26 ATMEL CORP

AI summary

A method and system for fabricating a interconnect substrate for a multi-component package is disclosed. The multi-component package includes at least one die and a package substrate. The method and system include providing an insulating base and providing at least one conductive layer. The at least one conductive layer provides interconnects for at least one discrete component. The interconnect substrate is configured to be mounted on the at least one die and to have the at least one discrete component mounted on the interconnect substrate.