Superimposed Fin Groups and Parallel Heatpipes for Uniform Cooling

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Solution Overview

Problem

Existing cooling devices fail to provide uniform cooling for heat-generating elements with varying heat outputs, leading to inefficient thermal management and potential reliability issues.

Innovation Solution

A cooling device design featuring a multilayer structure of heat-radiating fin groups and heat pipes, where heat pipes are thermally connected to multiple fin groups to distribute heat uniformly, with angled and bent configurations to enhance thermal connectivity and space efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a second heat pipe is separated from the heat sink to accommodate varying heat outputs, then adaptability to different heat-generating elements is improved, but uniform cooling performance deteriorates

Engineering Contradiction:

Improveadaptability to varying heat outputsVSAvoiduniform cooling performance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The heat sink is segmented into multiple independent heat-radiating fin groups (first, second, and third fin groups) that can be independently thermally connected to different heat pipes. This segmentation allows each fin group to be optimally coupled with specific heat-generating elements while maintaining uniform heat distribution across the entire heat sink structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second heat-radiating fin group serves multiple functions by being thermally connected to both the first heat pipe and the second heat pipe. This multi-functionality allows the same fin group to receive heat from multiple heat-generating elements with different heat outputs, ensuring uniform cooling performance while accommodating varying thermal loads.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If multiple heat-radiating fin groups are thermally connected to multiple heat pipes, then uniform cooling performance is improved, but device complexity increases

Engineering Contradiction:

Improveuniform cooling performanceVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple heat-radiating fin groups are thermally merged through shared thermal connection points on the heat sink body. The first, second, and third fin groups are all thermally connected to the heat sink, which acts as a common thermal distribution network, simplifying the overall structure while maintaining uniform cooling performance.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat pipes are nested within the heat sink structure, with their heat-radiating ends positioned to thermally connect to specific fin groups. The first heat pipe is nested to connect to the first and second fin groups, while the second heat pipe is nested to connect to the second and third fin groups, creating a compact integrated structure.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Volume of moving object

If heat pipes are positioned at different heights, then space efficiency is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvespace efficiencyVSAvoidthermal connection precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The heat pipes are arranged in the vertical dimension with different heights, allowing them to optimally connect to heat-generating elements at different positions. The first heat pipe extends to connect to the first fin group at a higher position, while the second heat pipe extends to connect to the third fin group at a lower position, efficiently utilizing the vertical space within the heat sink.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures uniform cooling of heat-generating elements, increases long-term reliability, and reduces thermal resistance, while maintaining compact dimensions and efficient heat dissipation.

Implementation Method 1

a first heat pipe having one end thermally connected to a first heat-generating element and another end thermally connected to a first heat-radiating fin group

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

thermally connected

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

heat-radiating fin group

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 4

heat dissipation

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11150028B2Cooling device with superimposed fin groups and parallel heatpipes

Publication Date: 2021.10.19 FURUKAWA ELECTRIC CO LTD

AI summary

A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.