Asymmetric Semiconductor Module Terminals for Vibration Resistance
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Solution Overview
Problem
Semiconductor modules face a challenge in miniaturization due to the need for increased pitch in arc-shaped boundary portions to enhance damage resistance, which compromises terminal insertion performance and module size.
Innovation Solution
The semiconductor module design incorporates right-angled connection portions for first terminals with small pitch and arc-shaped connection portions for second terminals with larger pitch, allowing for miniaturization while enhancing resistance to damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all terminal boundary portions are configured to be arc-shaped to enhance damage resistance, then terminal resistance to vibration damage is improved, but module size increases due to increased pitch requirements
Solution Approach 1:
The patent applies different connection portion configurations to different terminal types based on their specific requirements. Control terminals (first terminals) with small pitch use right-angled connection portions, while power terminals (second terminals) with large pitch use arc-shaped connection portions. This localized differentiation allows each terminal type to optimize for its specific function without compromising overall module compactness.
Solution Approach 2:
The patent segments the terminal group into two distinct categories (first terminals and second terminals) with different pitch characteristics. This segmentation allows the application of different structural solutions (right-angled vs. arc-shaped connection portions) to different segments, resolving the contradiction between damage resistance and module size by treating each segment according to its specific needs.
2Reliability
If pitch is increased to ensure insulation distance between control terminals with arc-shaped boundaries, then insulation performance is improved, but miniaturization is inhibited
Solution Approach 1:
The patent recognizes that control terminals have different insulation requirements compared to power terminals. By applying right-angled connection portions specifically to control terminals (first terminals), the design maintains adequate insulation performance for these sensitive terminals while allowing tighter pitch, thus enabling module miniaturization without compromising insulation reliability.
3Ease of operation
If terminal tip portion is narrower than base portion to ensure insertion performance, then insertion performance into substrate is improved, but stress concentration at boundary portion increases making terminal more susceptible to damage
Solution Approach 1:
The patent employs asymmetric connection portion designs tailored to each terminal type. Control terminals use right-angled asymmetric connections that provide sufficient stress resistance for their application, while power terminals use arc-shaped asymmetric connections that better handle the higher mechanical stresses. This asymmetric differentiation resolves the contradiction by optimizing each terminal's boundary geometry for its specific operational requirements.
Data Source
AI summary
A semiconductor module includes: a semiconductor chip; a package sealing the semiconductor chip; and a plurality of terminals connected to the semiconductor chip and protruding from the package, wherein the plurality of terminals includes a plurality of first terminals arranged side by side at a first pitch, and a plurality of second terminals arranged side by side at a second pitch, each terminal has a base portion, a tip portion narrower than the base portion, and a connection portion connecting the base portion and the tip portion, the connection portions of the plurality of first terminals are right-angled, and the connection portions of the plurality of second terminals are arc-shaped.