Asymmetric Electronic Substrate Manufacturing with Removable Carrier
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Solution Overview
Problem
Conventional electronic substrates require equal numbers of routing layers on both sides of the core due to manufacturing constraints, leading to unnecessary layers on the bottom side, which can position capacitors farther away from dies and reduce manufacturing efficiency.
Innovation Solution
The development of asymmetric electronic substrates with an unequal number of routing layers on each side of the core, achieved by incorporating a removable carrier layer in the manufacturing process, allowing for simultaneous production of two substrates with more efficient component placement and higher yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If equal numbers of routing layers are provided on both sides of the core, then manufacturing process stability is improved, but manufacturing productivity deteriorates due to unnecessary layers on the bottom side
Solution Approach 1:
The patent applies asymmetry by providing a different number of routing layers on the first side versus the second side of the core. Specifically, the first side has a first number of routing layers while the second side has a second number of routing layers, where these numbers are unequal. This asymmetric configuration eliminates unnecessary layers on the bottom side, allowing capacitors to be positioned closer to dies and improving manufacturing productivity while maintaining process stability through the use of a removable carrier layer.
2Device complexity
If equal numbers of routing layers are provided on both sides of the core, then manufacturing process simplicity is improved, but component placement efficiency deteriorates due to capacitors being positioned farther from dies
Solution Approach 1:
The patent implements asymmetry in the routing layer configuration, with the first side having a different number of routing layers than the second side. This asymmetric design enables capacitors to be positioned closer to the dies on the appropriate side, improving component placement efficiency and electrical performance while maintaining manageable manufacturing complexity through standardized processes applied to each side independently.
3Productivity
If a removable carrier layer is incorporated in the manufacturing process, then manufacturing productivity is improved by doubling output, but device complexity increases
Solution Approach 1:
The patent introduces a removable carrier layer as an intermediary element in the manufacturing process. This carrier layer serves as a temporary support structure that enables the fabrication of asymmetric routing layers on both sides of the core. The carrier layer is removed after the asymmetric layers are formed, allowing the production of two asymmetric substrates simultaneously. This intermediary approach doubles manufacturing output while keeping the added complexity temporary and manageable.
4Reliability
If unnecessary routing layers are provided on the bottom side, then manufacturing process robustness is improved, but capacitor positioning deteriorates due to increased distance from dies
Solution Approach 1:
The patent applies asymmetry by configuring the first side of the core with a different number of routing layers than the second side. This asymmetric routing layer configuration eliminates unnecessary layers on the bottom side, enabling capacitors to be positioned closer to the dies. This improves both electrical performance and manufacturing efficiency while maintaining process robustness through controlled fabrication sequences.
Data Source
AI summary
An asymmetric electronic substrate and method of making the substrate includes forming a first layer on each opposing major surface of a removable carrier layer, the first layer being a routing layer, simultaneously laminating the first layers, and building up subsequent layers on layers previously formed and laminated on the removable carrier layer iteratively. The subsequent layers including routing layers and a core layer formed on each side of the removable carrier layer, the core layer including through holes having a larger gauge than through holes included in the routing layers. A number of layers on a first side of the core layer, between the core layer and the carrier layer, is different than a number of layers on a second side of the core layer. The carrier layer is removed to produce two asymmetric substrates, each asymmetric substrate including one of the at least one core layers.