Insulating Layers/Substrates Working TRIZ Cases
- Glass Core TGV Processing With Surface Flattening and Protection
Laser-formed TGVs plus resin sealing and etching flatten and protect glass core surfaces to improve strength and reliability.
- Multilayer Coil Substrate Layout to Prevent Wiring Short Circuits
Thicker plated connection portions and thinner overlapping circuit areas keep conductor layers separated to reduce short-circuit risk.
- Ceramic Substrate Through-Hole Processing Before Annealing
Pre-anneal laser drilling and organic-member arraying improve ceramic substrate throughput by cutting time and blade wear.
- PCB Via Hole Formation Using Laser Desmear on Both Surfaces
CO2 laser drilling plus chemical desmear forms PCB vias from both sides, avoiding warping, fracture, residue buildup, and copper foil damage.