Insulating Layers/Substrates Working TRIZ Cases

Laser-formed TGVs plus resin sealing and etching flatten and protect glass core surfaces to improve strength and reliability.

Thicker plated connection portions and thinner overlapping circuit areas keep conductor layers separated to reduce short-circuit risk.

Pre-anneal laser drilling and organic-member arraying improve ceramic substrate throughput by cutting time and blade wear.

CO2 laser drilling plus chemical desmear forms PCB vias from both sides, avoiding warping, fracture, residue buildup, and copper foil damage.

A dual-laser cutting sequence separates display panels, then severs welded leads to avoid short circuits, dark lines, and yield loss.

A two-step ultrafast and longer-pulse laser process patterns PCB traces and blind microvias below 35 μm without toxic chemical etching.

Back-sputtering redistributes conductive fill into blind-hole wedges, enabling void-free component carrier vias at small line-space ratios.

Plasma treatment and ultrasonication form cavity recesses that remove smear and strengthen conductor adhesion under thermal stress.

Varying board connections supports stable division and accurate component mounting.

A PCB cutting tool uses a guide rib to align with board slots for precise isthmus separation.

A via hole structure uses a conductive cover section to form vertical connections through carrier board layers.

Segmented cover with recesses guides separation tools while suction prevents board detachment and particle contamination.

A photosensitive resin composition uses a dicyclopentanyl binder polymer and specific sensitizers to form fine resist patterns.

Replacing mechanical contacts with electromagnetic induction allows looser manufacturing tolerances while maintaining reliable data transmission.

Pre-cutting silk application on PCB joint areas prevents shavings generation, eliminating post-process cleaning steps and reducing manufacturing complexity.

Horizontal substrate positioning prevents shadowing during etching, reducing residence time and energy consumption while ensuring complete active metal removal.

A mother laminate cutting method uses sequential cuts to separate individual electronic components while maintaining structural integrity.

Laser modification of a glass substrate enables selective wet etching that eliminates edge grinding and reduces cracking during cutting.

Chemical etching removes glass cloth protrusion from laser-formed via holes, suppressing etch back and improving plating solution flowability.

Electroless copper plating on prepreg layers constructs fine line circuits while reducing material costs by half compared to standard substrates.

Perylene and complementary coloring agents in a photosensitive resin composition achieve high tinting strength while maintaining sufficient curing depth.

Chemical etching creates smooth via channels in dielectric substrates.

Chemical etching with basic materials removes silicon nitride at low temperatures, eliminating mask requirements and component damage.