Insulating Layers/Substrates Working TRIZ Cases

Laser-formed TGVs plus resin sealing and etching flatten and protect glass core surfaces to improve strength and reliability.

Thicker plated connection portions and thinner overlapping circuit areas keep conductor layers separated to reduce short-circuit risk.

Pre-anneal laser drilling and organic-member arraying improve ceramic substrate throughput by cutting time and blade wear.

CO2 laser drilling plus chemical desmear forms PCB vias from both sides, avoiding warping, fracture, residue buildup, and copper foil damage.

A dual-laser cutting sequence separates display panels, then severs welded leads to avoid short circuits, dark lines, and yield loss.

A two-step ultrafast and longer-pulse laser process patterns PCB traces and blind microvias below 35 μm without toxic chemical etching.

Back-sputtering redistributes conductive fill into blind-hole wedges, enabling void-free component carrier vias at small line-space ratios.

Plasma treatment and ultrasonication form cavity recesses that remove smear and strengthen conductor adhesion under thermal stress.

Varying board connections supports stable division and accurate component mounting.

A PCB cutting tool uses a guide rib to align with board slots for precise isthmus separation.

A via hole structure uses a conductive cover section to form vertical connections through carrier board layers.

Segmented cover with recesses guides separation tools while suction prevents board detachment and particle contamination.

A photosensitive resin composition uses a dicyclopentanyl binder polymer and specific sensitizers to form fine resist patterns.

Replacing mechanical contacts with electromagnetic induction allows looser manufacturing tolerances while maintaining reliable data transmission.

Pre-cutting silk application on PCB joint areas prevents shavings generation, eliminating post-process cleaning steps and reducing manufacturing complexity.

Horizontal substrate positioning prevents shadowing during etching, reducing residence time and energy consumption while ensuring complete active metal removal.

A mother laminate cutting method uses sequential cuts to separate individual electronic components while maintaining structural integrity.

Laser modification of a glass substrate enables selective wet etching that eliminates edge grinding and reduces cracking during cutting.

Chemical etching removes glass cloth protrusion from laser-formed via holes, suppressing etch back and improving plating solution flowability.

Electroless copper plating on prepreg layers constructs fine line circuits while reducing material costs by half compared to standard substrates.

Perylene and complementary coloring agents in a photosensitive resin composition achieve high tinting strength while maintaining sufficient curing depth.

Chemical etching creates smooth via channels in dielectric substrates.

Chemical etching with basic materials removes silicon nitride at low temperatures, eliminating mask requirements and component damage.

Fluorovinyl ether plasma removes resin and silica residues from laser-drilled vias, ensuring reliable electrical connections.

Aqueous alkaline pre-treatment solution stabilizes palladium activation layer deposition on non-conductive substrates.

Acid-soluble magnesium oxide filler creates low-roughness anchors that resolve the adhesive strength versus plating removal trade-off.

UV light irradiation in oxygen removes viahole smear while preserving insulating layer smoothness, enabling high-density fine wiring patterns.

Segment inner-hole conductive layers via peripheral drilling to suppress peeling, resolving the trade-off between manufacturing speed and layer integrity.

A removable carrier layer enables simultaneous fabrication of asymmetric electronic substrates with unequal routing layers on each side.

A glass substrate layer minimizes thermal expansion in printed circuit boards to maintain dimensional stability.

Laser drilling followed by ultrasonic-assisted acid etching improves glass via dimension precision while reducing thermal mismatch issues.

Thermal conduction structures homogenize temperature distribution within laminated panels, reducing warpage caused by uneven curing and internal stress.

Recess structures guide motherboard fracture along target paths to enable physical cutting without laser irradiation.

Laser ablation removes circuit board base material without damaging metal connections, eliminating mechanical stress and splintering during panel separation.

Connect unstructured carrier film to layer sequence for precise through contact formation.

Ultraviolet irradiation and silane coupling agents treat resin substrates to enhance electroless plating adhesion despite low surface roughness.

An assembly sheet overlapped with a supporting sheet enables unified transport of separated wiring circuit boards.