Photosensitive Resin Composition for Fine Resist Patterns
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Solution Overview
Problem
The miniaturization of conductor patterns in printed wiring boards requires a photosensitive resin composition that can form finer resist patterns with line and space widths of 5 μm or less, and ultimately 1 μm or less, while maintaining high resolution and adhesiveness.
Innovation Solution
A photosensitive resin composition comprising a binder polymer with a dicyclopentanyl group, a photopolymerizable compound, a photopolymerization initiator, a sensitizer absorbing between 340 to 430 nm, and an ultraviolet absorber with a high molar absorption coefficient at 365 nm, which enhances resolution and adhesiveness and allows for the formation of fine resist patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photosensitive resin compositions are used, then existing resist pattern formation is achieved, but resolution and adhesiveness are insufficient for finer patterns with line and space widths of 5 μm or less
Solution Approach 1:
The patent changes the chemical composition parameters of the photosensitive resin by incorporating specific compounds: a binder polymer with dicyclopentanyl group (providing adhesion), photopolymerizable compounds for crosslinking, sensitizers absorbing at 340-430 nm, and ultraviolet absorbers with high molar absorption coefficients at 365 nm. These parameter changes enable simultaneous achievement of high resolution and adhesiveness in fine resist patterns
Solution Approach 2:
The patent creates a composite photosensitive resin composition combining multiple functional components: binder polymer (for adhesion), photopolymerizable compound (for curing), sensitizer (for light absorption), and ultraviolet absorber (for exposure control). This composite material approach allows the composition to achieve both high resolution and adhesiveness that cannot be obtained with single-component systems
2Manufacturing precision
If conventional photosensitive resin compositions are used, then existing sensitivity is achieved, but sensitivity is insufficient for forming finer resist patterns with line and space widths of 5 μm or less
Solution Approach 1:
The patent optimizes the sensitivity parameter by selecting photopolymerizable compounds with appropriate reactivity, photopolymerization initiators with suitable absorption characteristics, and sensitizers that absorb in the 340-430 nm range. These parameter changes enable the formation of fine resist patterns with high sensitivity, allowing precise pattern formation at 5 μm or less line and space widths
3Manufacturing precision
If conventional photosensitive resin compositions are used, then existing resist pattern formation is achieved, but resist footing occurs in fine pattern formation
Solution Approach 1:
The patent modifies the compositional parameters to control the curing behavior and adhesion characteristics. The binder polymer with dicyclopentanyl group provides anchoring to the substrate, while the specific ratio of photopolymerizable compounds and crosslinking agents controls the cure profile. These parameter changes prevent resist footing by ensuring proper adhesion and controlled curing in fine pattern formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent resolution and adhesiveness, enabling the formation of fine resist patterns with improved sensitivity and reduced resist footing, suitable for advanced printed wiring board production.
Implementation Method 1
a photopolymerizable compound; a photopolymerization initiator; a sensitizer having an absorption at 340 to 430 nm
Implementation Method 2
an ultraviolet absorber, in which a molar absorption coefficient of the ultraviolet absorber for light at a wavelength of 365 nm is in a range of 500 to 50000 L/(mol·cm)
Data Source
AI summary
A photosensitive resin composition according to an embodiment of the present disclosure contains: a binder polymer including a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group; a photopolymerizable compound; a photopolymerization initiator; a sensitizer having an absorption at 340 to 430 nm; and an ultraviolet absorber, in which a molar absorption coefficient of the ultraviolet absorber for light at a wavelength of 365 nm is in a range of 500 to 50000 L/(mol·cm).