PCB Depaneling Cover With Segmented Recesses

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Solution Overview

Problem

Existing printed circuit board separators are not well-suited for separating substrates with different layouts, and they fail to prevent isolated boards from being detached during mechanical separation, leading to contamination with particles or shavings.

Innovation Solution

A printed circuit board separating device with a covering device that overlaps sections of the substrate, featuring recesses for access and a suction device to prevent detachment, and adjustable holding and support elements for secure positioning, allowing for flexible attachment and minimizing tool breakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a covering device is introduced to prevent detachment of isolated boards, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveprevention of board detachmentVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The covering device is segmented into multiple cover sections that can be independently positioned over different areas of the circuit board substrate. Each cover section can be separately adjusted and secured, allowing the system to provide comprehensive coverage without requiring a single complex monolithic structure. This segmentation enables reliable prevention of board detachment while keeping individual components simple.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The covering device serves multiple functions simultaneously: it prevents isolation of individual boards during separation, protects the working area from particles and shavings, and can be adjusted to accommodate different board layouts. By integrating these multiple functions into a single device system, the patent improves reliability without proportionally increasing complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of operation

If recesses are provided for access passage, then ease of operation is improved, but device complexity increases

Engineering Contradiction:
Improveaccess for separating deviceVSAvoidstructure complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The covering device incorporates recesses that create access passages through the cover sections. These recesses are strategically positioned to allow the separating device to reach the circuit board substrate without requiring complex movable or removable structures. The access passages are integrated directly into the cover section geometry, providing ease of operation while maintaining structural simplicity.

Inventive Principle:
Principle #1Segmentation

3Object-affected harmful factors

If suction device is used to prevent contamination, then purity is improved, but device complexity increases

Engineering Contradiction:
Improvecontamination from particlesVSAvoidsystem complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The suction device acts as an intermediary system that removes particles and shavings from the working area before they can contaminate the circuit board substrate. By introducing this intermediate removal mechanism, the patent addresses contamination issues without requiring the covering device itself to be complex - the suction system works in conjunction with the simple cover sections to achieve purity.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Reliability

If additional holding and support elements are provided, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improvepositioning stabilityVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The holding and support elements are segmented into distinct functional components: holding elements that secure the covering device to the base, and support elements that provide additional structural stability. This segmentation allows each element to be optimized for its specific function while keeping the overall system manageable. The elements can be independently positioned and adjusted to achieve reliable positioning stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The additional holding and support elements are designed to be adjustable and repositionable, allowing the system to adapt to different circuit board layouts and separation requirements. This dynamic capability enables the same set of elements to provide reliable positioning stability across various applications without requiring a completely different structure for each scenario.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively prevents detachment of printed circuit boards during mechanical separation, maintains cleanliness by containing particles, and allows for precise processing with reduced risk of tool breakage and contamination.

Implementation Method 1

The particles or shavings produced during the course of a milling process by processing the printed circuit board substrate can be sucked off with the aid of the suction device

Methodology Applied
Scientific EffectSuction: Suction

Implementation Method 2

The base (14) is designed in particular in the form of a magnetic base plate (16)... the additional holding elements (24) and/or the additional support elements (26) having a magnetically effective foot section (28)

Methodology Applied
Scientific EffectMagnetism: Magnetism

Data Source

PatentEP2482625B1Circuit board separation device
Publication Date: 2013.09.18 SCHUNK ELECTRONICS SOLUTIONS GMBH
  • EP2482625B1 patent drawingFigure 1
  • EP2482625B1 patent drawingFigure 2

AI summary

The depaneling device (10) has plate-shaped cover (44) which is arranged on base (14) of workpiece carrier (12), such that cover is arranged in opposition to PCB substrate (30) on workpiece carrier. The cover includes a cover portion (74) that covers the PCB portion. The cover portion is comprised of recesses (62) with confined spaces (64) having access passages (66) through which separation device (68) access the PCB substrate.