Ceramic Substrate Through-Hole Processing Before Annealing
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Solution Overview
Problem
Existing methods for processing ceramic substrates face inefficiencies in cutting speed and blade lifetime due to the hardness of the material, and low laser beam absorption leading to inefficient cutting.
Innovation Solution
A method involving annealing, arraying, fixing with an organic member, laser processing through holes, conductor filling, wiring printing, and cutting the organic member to divide the substrate into smaller units, enhancing processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If cutting is performed using a dicer on annealed substrate, then the substrate can be divided into pieces, but cutting speed significantly reduces and blade lifetime reduces due to material hardness
Solution Approach 1:
The patent applies preliminary action by performing laser processing on the raw ceramic substrate before annealing to create through-holes. This preliminary processing step allows the through-holes to be formed when the material is softer, avoiding the need to cut through hardened material later, thus improving cutting speed and blade lifetime.
Solution Approach 2:
The patent segments the processing steps by separating through-hole formation from the final substrate division. Through-holes are created in individual small substrates before stacking, while the final cutting through the organic member occurs after annealing but targets only the bonding material rather than the ceramic itself.
2Productivity
If cutting is performed using laser beam, then cutting can be done without mechanical contact, but if absorption rate of laser beam is low, cutting becomes inefficient and takes time
Solution Approach 1:
The patent changes the parameter of material state by performing laser processing before annealing. The raw ceramic substrate has different laser absorption characteristics compared to the annealed substrate, allowing more efficient energy absorption and faster processing before the material hardens.
3Manufacturing precision
If laser processing is performed on annealed substrate, then through holes can be processed, but processing time increases due to low absorption rate
Solution Approach 1:
The patent performs laser processing as a preliminary action before annealing when the ceramic substrate has not yet hardened. This timing allows for faster laser absorption and processing while maintaining the precision needed for through-hole formation, avoiding the time loss that would occur if processing were done after annealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves processing efficiency by reducing cutting time and extending blade life, while maintaining high precision.
Implementation Method 1
a step of emitting laser beam to the arrayed small substrates in the large substrate to process a through hole
Implementation Method 2
a step of fixing the arrayed small substrates by using an organic member to form a large substrate
Data Source
AI summary
A purpose of the present invention is to provide a method of processing a substrate to improve a processing efficiency of the substrate. The method includes steps of: dividing a raw ceramic substrate into small substrates; annealing the divided small substrates; arraying the annealed small substrates; fixing the arrayed small substrates by using an organic member to form a large substrate; emitting laser beam to the arrayed small substrates in the large substrate to process a through hole; filling the through hole with a conductor; printing a wiring on the arrayed small substrates in the large substrate; stacking a new layer on front and back surfaces of the arrayed small substrates in the large substrate; and cutting the organic member of the large substrate to divide the large substrate into the small substrates.