PCB Division Shavings Prevention via Pre-Cut Silk Coating

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Solution Overview

Problem

The production of shavings during the division of printed circuit boards leads to image defects in image forming apparatuses, and existing methods to reduce shavings, such as applying resist after cutting, increase manufacturing effort and costs.

Innovation Solution

Applying silk or resist to the entire area of the divided portions of the printed circuit board before cutting to minimize shavings production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a printed circuit board is cut with a router to divide it into multiple boards, then the printed circuit boards can be separated into individual units, but shavings are produced that can adhere to optical components and cause image defects

Engineering Contradiction:
Improveboard division processVSAvoidshavings production
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent applies resist to the joint portions of the printed circuit board before cutting with a router. This preliminary application of resist prevents shavings from being generated during the cutting process, thereby eliminating the harmful effect while maintaining the ease of manual division process.

Inventive Principle:
Principle #10Preliminary action

2Object-generated harmful factors

If resist is applied to the cut end surfaces after cutting to reduce shavings, then shavings production is reduced, but manufacturing effort and costs increase

Engineering Contradiction:
Improveshavings productionVSAvoidmanufacturing process
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The patent applies resist to the joint portions before cutting instead of after cutting. This preliminary action eliminates the need for subsequent resist application steps, reducing manufacturing effort and process complexity while still preventing shavings production.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent extracts the resist application step from the post-cutting process and relocates it to the pre-cutting stage. This repositioning eliminates the additional working process that would be required after cutting, thereby reducing manufacturing complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

3Object-generated harmful factors

If resist is applied to the cut end surfaces after cutting to reduce shavings, then shavings production is reduced, but manufacturing costs increase

Engineering Contradiction:
Improveshavings productionVSAvoidmanufacturing cost
Core Design Contradiction:
Object-generated harmful factorsVSProductivity

Solution Approach 1:

The patent applies resist to the joint portions before cutting with a router. This preliminary application prevents shavings from forming during cutting, eliminating the need for post-cutting resist application and associated manufacturing costs.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent removes the additional resist application step from the manufacturing process by performing it beforehand. This extraction of the unnecessary post-cutting step reduces manufacturing costs while maintaining effective shavings prevention.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS9939753B2Printed circuit board, exposure device having printed circuit board, and image forming apparatus
Publication Date: 2018.04.10 CANON KK
  • US9939753B2 patent drawing
  • US9939753B2 patent drawing
  • US9939753B2 patent drawing

AI summary

A printed circuit board of which a part of at least one side of the circuit board is divided by a division process including a first area where a component is placed, and a divided portion where the component is not placed, and which includes the part of the at least one side. Silk is applied to an entire area of the divided portion.