Electronic Component Lamination Cutting Sequence
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Solution Overview
Problem
Conventional methods for producing electronic components with laminated insulating layers often result in distortion and cracking due to the cutting process, particularly when external electrodes with higher ductility are cut, causing significant force to be applied to the laminate, leading to potential distortion and damage.
Innovation Solution
A method involving a mother laminate cut in a specific sequence along predetermined cutoff lines, where external conductors are joined in a point-symmetrical arrangement, allowing for controlled cutting that minimizes distortion by avoiding the cutting of united conductors during the initial cuts, thereby reducing the transmission of cutting forces to adjacent laminates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the mother laminate is cut along cutoff lines where external electrodes are located, then the external electrodes are separated into individual laminates, but the cutting force causes distortion and cracking in the laminate
Solution Approach 1:
The patent applies preliminary action by performing the first cut in the first direction to divide the mother laminate into strips before performing the second cut in the second direction. This sequence is deliberately chosen because the external electrodes are arranged such that the first cut does not intersect them, avoiding the high cutting force problem while still achieving eventual separation
Solution Approach 2:
The cutting process is segmented into two distinct directions and sequences: first cutting in the first direction to create strips, then cutting in the second direction to separate individual laminates. This segmentation of the cutting operation allows avoidance of high-stress cutting lines while achieving complete separation
2Ease of manufacture
If external electrodes with higher ductility are cut, then they are separated from the laminate, but significant force is applied to the laminate causing distortion
Solution Approach 1:
The patent performs preliminary cutting in the first direction along lines where no external electrodes are present, separating the laminate into strips without applying significant force to the electrodes. This preliminary action reduces the overall structure while avoiding the high-force electrode cutting, thereby protecting laminate strength
Solution Approach 2:
Instead of cutting directly through external electrodes as would be the straightforward approach, the patent inverts the cutting sequence to first cut in the direction parallel to electrode rows, then cut perpendicular to them. This indirect approach avoids direct electrode cutting forces
Data Source
AI summary
A method for producing an electronic component including a laminate, a circuit element provided therein, and external conductors electrically connected thereto. The method including steps of obtaining a mother laminate that has a plurality of the laminates arranged in a matrix-like state in a first direction and a second direction perpendicular thereto. The mother laminate is cut into the laminates. In the step of obtaining, the mother laminate is obtained such that the external conductors of two laminates adjacent in the first direction are joined, and circuit elements provided in the two laminates have a point-symmetrical relationship with each other. In the step of cutting, the mother laminate is cut along first cutoff lines extending in the second direction after the mother laminate is cut along second cutoff lines extending in the first direction. The external conductors are located on corresponding first cutoff lines.