Atomic-Smooth Microstructure Surface Without Burrs or Pits

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Solution Overview

Problem

Existing methods for preparing atomic-smooth surfaces with microstructures are hindered by the formation of burrs and pits at material junctions, leading to non-smooth edges and reduced service life in micro-generators due to friction and wear, necessitating high-precision polishing equipment and processes that are costly and difficult to implement.

Innovation Solution

A method involving a two-dimensional material with atomic-smooth characteristics, where a substrate and the material are mechanically peeled under external force, using a bonding material to connect the surface with potential pits as the bottom, and subsequent oxygen plasma etching to remove residual material, creating an atomic-smooth surface without burrs or pits, thus avoiding traditional machining issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If traditional micromachining processes are used to prepare surfaces with microstructures, then microstructures can be formed, but burrs and pits appear at material junctions causing non-smooth surfaces

Engineering Contradiction:

Improvemicrostructure formationVSAvoidsurface smoothness

Core Design Contradiction:

ShapeVSManufacturing precision

Solution Approach 1:

The invention separates the microstructure formation and surface smoothing processes by using a sacrificial layer approach. The microstructure is first formed, then a sacrificial layer is deposited and selectively removed to create the smooth surface, dividing the conflicting requirements into sequential steps

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A sacrificial layer is introduced as an intermediary material between the microstructure and the final smooth surface. This layer allows the microstructure to be formed first, then provides a template for creating the smooth surface through selective removal, mediating between the rough microstructured surface and the desired smooth finish

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If high-precision polishing equipment and processes are used to remove burrs and pits, then surface smoothness is improved, but equipment cost and process complexity increase

Engineering Contradiction:

Improvesurface smoothnessVSAvoidpolishing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention replaces mechanical polishing processes with a chemical/physical vapor deposition and selective removal process. Instead of using complex mechanical polishing equipment to remove burrs, a sacrificial layer is deposited and selectively etched away, substituting mechanical removal with a more controllable chemical process

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The sacrificial layer serves as an intermediary that simplifies the smoothing process. Rather than directly polishing the complex microstructured surface, the smooth surface is created by depositing and removing the sacrificial layer, which acts as a temporary template and eliminates the need for high-precision mechanical polishing

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If atomic-smooth surfaces are required for micro-generators to reduce friction and wear, then service life is improved, but the manufacturing process becomes more difficult and costly

Engineering Contradiction:

Improveservice lifeVSAvoidmanufacturing difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The sacrificial layer acts as a mediator that enables atomic-smooth surface creation without complex manufacturing. By depositing the sacrificial layer on the microstructured surface and selectively removing it, the process achieves atomic-smoothness through a relatively simple PVD/CVD and etching sequence, making atomic-smooth surfaces manufacturable

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The microstructure is formed first as a preliminary step, then the sacrificial layer is deposited and removed to create the smooth surface. This preliminary formation of the underlying structure allows the final smoothing step to focus only on surface quality, simplifying the overall manufacturing process while achieving atomic-smooth surfaces

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively produces a large-area atomic-smooth device with microstructures up to 100 μm in diameter, eliminating the need for high-precision polishing and ensuring a smooth surface, thereby enhancing the service life and power output of micro-generators.

Implementation Method 1

the residual two-dimensional material may be removed by oxygen plasma etching to obtain an atomic-smooth surface with a microstructure

Methodology Applied

Scientific EffectOxygen plasma etching: Plasma

Data Source

PatentUS20230271825A1Atomic-smooth device with microstructure, and method for preparing same

Publication Date: 2023.08.31 RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN

AI summary

Provided is an atomic-smooth device with a microstructure. The device includes, from the bottom to top, a substrate, a bonding material, a second dielectric layer on the substrate, the microstructure, and a first dielectric layer, where a surface of the first dielectric layer is an atomic-smooth surface. Further provided is a method for preparing an atomic-smooth device with a microstructure to effectively avoid pits or burrs generated when the existing microstructure is machined.