AuSn Through-Via Bonding for Reliable Insulated Component Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The direct bonding process for LED components with multiple functional layers faces a narrow process window due to the need for precise positioning of metallic contact posts, which can interfere with bonding and fail to maintain contact during annealing.
Innovation Solution
A method involving a gold-tin alloy connecting stack, where the gold and tin layers are melted to form a through-via, establishing an electrical connection after a mechanical bond is formed, allowing for a wider process window and minimizing delamination risks by precise adjustment of the connecting stack's distance from the bond interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If metallic contact posts are moved back from the planarized surfaces, then the direct bonding process can proceed without interference, but the contact between metallic posts will not close during subsequent annealing step
Solution Approach 1:
The patent introduces a solder material layer as an intermediary substance between the metallic contact posts and the planarized surfaces. This solder material serves as a mediator that can be melted during annealing to create reliable electrical connections, while allowing the metallic posts to be positioned at optimal distances from the surfaces without interfering with the direct bonding process
Solution Approach 2:
The patent changes the physical state of the solder material from solid to liquid during the annealing process through temperature control. This phase change enables the solder to flow and establish reliable electrical connections between component parts, resolving the contradiction between maintaining surface planarization precision and ensuring electrical connection reliability
2Reliability
If metallic contact posts are not moved back, then contact can be maintained during annealing, but they will interfere with the direct bonding process
Solution Approach 1:
The solder material acts as an intermediary that decouples the positioning requirements of metallic contact posts from the direct bonding process. The posts can remain in position without interfering with bonding, while the solder material ensures reliable electrical connections are formed during annealing
3Manufacturing precision
If the process window is narrowed for precise positioning, then direct bonding accuracy is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent utilizes the phase change parameter of solder material (from solid to liquid during annealing) to simplify the overall process. This natural phase transition provides self-alignment and connection formation, reducing the need for complex process control while maintaining high positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a reliable and stable electrical connection while maintaining mechanical stability, with the gold-tin alloy expanding to form a conductive through-via, offering improved reliability and precision over conventional metal-based solutions like copper or nickel.
Implementation Method 1
The gold layer and the tin layer are melted to form a gold-tin alloy
Implementation Method 2
the connecting stack has a protective layer which is arranged on the gold layer or on the tin layer. When the component parts are joined together, the opening of the first insulation layer and the corresponding opening of the second insulation layer can form a closed intermediate space
Data Source
AI summary
A method for producing a connection between component parts and a component made of component parts are disclosed. In an embodiment, a includes providing a first component part having a first exposed insulation layer and a second component part having a second exposed insulation layer, wherein each of the insulation layers has at least one opening, joining together the first and second component parts such that the opening of the first insulation layer and the opening of the second insulation layer overlap in top view, wherein an Au layer and a Sn layer are arranged one above the other in at least one of the openings and melting the Au layer and the Sn layer to form an AuSn alloy, wherein the AuSn alloy forms a through-via after cooling electrically conductively connecting the first component part to the second component part.