Semiconductor/Solid-State Device Details TRIZ Cases
- LED Package Structure Using Hollow Particles for Uniform Color
Hollow particles in a light-transmissive layer scatter light and mask phosphor visibility, improving LED surface color uniformity.
- Grooved Semiconductor Package Structure for Low-Height Die Stability
Grooves and insulating dielectric fix semiconductor die stacks in place, cutting package height and reducing translocation during vibration.
- Preformed Mask EMI Shielding for Semiconductor Package Contacts
A reusable preformed mask enables selective EMI shielding on semiconductor packages while keeping exposed contacts free from shorts.
- Dielectric Helmet BEOL Interconnects for Self-Aligned Via Scaling
A non-conformal dielectric helmet enables self-aligned BEOL vias at tight pitches, improving overlay control, yield, and via shorting margins.
- TSV Conductive Plug Isolation Ring for Stress and EMI Control
An isolation ring around a TSV conductive plug buffers thermal-mismatch stress and shields electric fields to protect nearby semiconductor elements.
- OLED Bonding Pad Barrier Structure for Copper Line Oxidation
A moisture-oxygen barrier built into the bonding pad protects copper OLED bonding lines from oxidation, preserving conductivity and simplifying fabrication.
- Power Module Heat Dissipation Structure for Shorter Thermal Paths
A chambered heat dissipation plate with internal bumps shortens thermal paths, spreads heat, and reduces ceramic substrate stress.
- Dual-Sided Water Jacket Package for High-Density Power Module Cooling
A continuous water channel cools substrates on both sides of a power electronics package, improving heat dissipation in compact high-power assemblies.
- Alternating Dielectric Package Substrate for Fine-Pitch Via Alignment
Alternating positive and negative photo-imageable dielectrics enable self-aligned fine-pitch vias, lowering stress and bump variation in package substrates.
- Flexible Semiconductor Package Heat Dissipation Resin Layer
A thermally conductive resin layer dissipates heat from flexible semiconductor packages without sacrificing substrate flexibility or insulation.
- Embedded Serializer SiP Camera Module for Compact Sensor Integration
Embedding the serializer inside the substrate shortens sensor connections, simplifies camera assembly, and reduces module size and cost.
- Semiconductor Package Bump Layout for Chip Alignment During Bonding
Thicker insulated dummy bumps and a surrounding conductive layer use reflow surface tension to limit chip misalignment and improve bonding yield.
- Stacked Semiconductor Package Thermal Sensing for TIM Degradation
Multiple central and peripheral temperature sensors detect thermal conductive member deterioration in stacked chips for better heat dissipation.
- Inclined Jet Manifold for Chip Edge Cooling and Plate Strength
Angled near-edge jet cooling improves chip heat transfer while preserving orifice plate strength and hermetic sealing under high pressure.
- One-Part Thermally Conductive Silicone Grease for Room-Temperature Storage
A microparticle platinum catalyst enables one-part thermally conductive silicone grease to store at room temperature and cure without heating.
- Semiconductor Terminal Layout for Low-Inductance Heat Dissipation
Overlapping terminals and conductors in the thickness direction shorten current paths, cutting inductance while expanding heat dissipation area.
- Airgap Electronic Fuse Link for Uniform Low-Current Programming
An airgap under the silicide fuse link improves thermal isolation, boosts electromigration efficiency, and reduces programmed resistance variation.
- Superconducting Interconnect Track With Kapitza Interfaces for Heat Blocking
Multiple superconducting sections create Kapitza interfaces that reflect phonons, limiting heat flow while preserving compact electrical links.
- Bonding Ribbon Geometry for RF Power Cycling Thermal Stress
A wide bonding ribbon links RF power transistors to the matching network, easing thermal stress from power cycling without adding resonant issues.
- Stacked Semiconductor Package Thermal Paths Using TSVs and Bump Pads
Varying bump pad areas and solder bump layouts create dedicated heat paths through TSVs, lowering thermal resistance in stacked chips.
- Wafer Dicing with Dual-Side Femtosecond Scribing and Plasma Etching
Dual-side femtosecond laser scribing and plasma etching enable clean wafer singulation with backside metallization and less die-edge damage.
- 3D Hyperchip Assembly Using Active Die Interposer Architecture
Replacing 2.5D interposers with TSV and microbump 3D stacking increases die connections while improving yield and reducing layout complexity.
- Branched Heat Sink Structure for Narrow-Space Cooling
A branched flat-plate heat sink creates 3D airflow channels to improve narrow-space cooling while preserving strength and simpler manufacturing.
- Bottom Via Spacer Interconnect Structure for Via Misalignment
A conformal dielectric spacer between bottom and top vias reduces misalignment, shorts, and dielectric breakdown in scaled interconnects.
- Semiconductor Cooling Jacket Layout for Uniform Module Temperatures
A divided cooling jacket and refrigerant groove balance flow and temperature across active elements, reducing thermal variation under high load.
- Photoelectric Conversion Panel Groove Layout for Leakage-Free Barrier Sealing
Offset multi-level grooves and inorganic barrier films block moisture and gas entry while preventing metal residue leakage in panel manufacturing.
- Semiconductor Mark Structure Layout for Higher Alignment Contrast
Differentiated dielectric thickness at the mark structure boosts imaging contrast, improving photoetching alignment accuracy, yield, and efficiency.
- Chip Carrier Pad Offset Layout for High-Voltage Die Isolation
An offset carrier contact keeps electric fields from the die edge termination away from the chip carrier while supporting thermal packaging needs.