Additive Printed Sensor on Semiconductor Package
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Solution Overview
Problem
Current methods for integrating sensors into packaged semiconductor devices, such as custom packaging and separate circuit board-level integration, are costly and expose the IC chip to environmental conditions, leading to issues like humidity trapping and compliance failures.
Innovation Solution
Fully-integrated additively fabricated sensors are created using ink-based deposition on the outside or inside of packaged semiconductor devices, allowing for environmental exposure without custom packaging, utilizing inkjet or similar additive printing systems to form sensors on exposed bond pads or the package surface, enabling wireless coupling of sensing signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If custom packaging is used to expose the silicon substrate to the environment for sensor integration, then sensor functionality is achieved, but packaging cost increases significantly and the entire IC chip top surface is exposed to environmental conditions causing humidity trapping and compliance failures
Solution Approach 1:
The patent segments the sensor functionality from the main IC chip by creating a separate sensor die that can be independently packaged. This allows the sensor to be exposed to environmental conditions while the main IC chip remains protected in a standard package, resolving the contradiction between achieving sensor functionality and preventing harmful environmental exposure of the IC chip.
Solution Approach 2:
The patent introduces a standard package as an intermediary between the sensor and the environment. The package provides a controlled interface that allows environmental stimuli to reach the sensor while protecting the IC chip from direct environmental exposure, thus eliminating humidity trapping issues and compliance failures.
2Ease of manufacture
If on-chip sensor integration is implemented during wafer fabrication, then low cost and full integration are achieved, but special custom packaging is required which increases cost
Solution Approach 1:
The patent divides the sensor integration into separate manufacturable units - a sensor die and an IC die - that can be fabricated using standard processes. This segmentation allows each component to be manufactured independently using conventional techniques, eliminating the need for complex custom packaging while maintaining ease of manufacture.
Solution Approach 2:
The patent creates a universal sensor die design that can be integrated into various IC packages using standard bonding techniques. This universal approach allows the sensor to be manufactured separately and then integrated into different package types without requiring specialized packaging processes, thus maintaining ease of manufacture while reducing device complexity.
3Reliability
If separate circuit board-level integration is used to interface the analog front end with the packaged sensor, then sensor functionality is achieved, but cost increases due to non-integrated solution requiring PCB assembly
Solution Approach 1:
The patent merges the analog front end and sensor die into a single integrated package assembly. The AFE die is bonded directly to the sensor die within the same package, eliminating the need for separate PCB-level integration. This merging maintains reliable signal processing while significantly reducing manufacturing cost by eliminating PCB assembly steps.
Solution Approach 2:
The patent implements a nested structure where the sensor die and AFE die are both contained within the same package housing. The sensor die is bonded to the AFE die, creating a compact integrated assembly that eliminates external PCB connections, thus achieving cost-effective integration while maintaining reliable signal processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for cost-effective, fully-integrated sensors with controlled environmental exposure, reducing board mount parasitics and enabling multiple sensor types on a single chip, while maintaining standard packaging and protecting the die from environmental conditions.
Implementation Method 1
The ink is additively depositable by an ink printer apparatus. The ink printing apparatus can comprise an inkjet printer that uses piezoelectric, thermal, or acoustic or electrostatics
Implementation Method 2
in the case of a polymer precursor the ink can be an ultraviolet (UV)-curable polymer or a UV-curable polymer-based mixture
Implementation Method 3
sintering (for inks including particles) to remove a liquid carrier which includes a solvent and/or a dispersant
Implementation Method 4
an inkjet printer that uses piezoelectric, thermal, or acoustic or electrostatics
Data Source
AI summary
A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.