Integrated TIM2 Assembly for IC Thermal Coupling Control
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Solution Overview
Problem
The challenge lies in ensuring optimal thermal performance of integrated circuit (IC) dies during assembly, as the qualification of thermal interface materials is time-consuming and labor-intensive, and superior materials may pose assembly challenges, preventing the achievement of best possible thermal performance.
Innovation Solution
Integrating a second-level thermal interface material (TIM) directly into the IC assembly at a first-level assembly stage, allowing it to be coupled with an assembly substrate and subsequently with a thermal solution, optimizing thermal conductivity and reducing the burden on system-level integrators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a superior thermal interface material is used to achieve optimal thermal performance, then thermal conductivity is improved, but assembly complexity increases
Solution Approach 1:
The patent merges the thermal interface material application process into the first-level IC die assembly process. The TIM is applied to the IC die backside at the first-level assembly stage and cured before the IC die is attached to the assembly substrate. This integration eliminates the need for separate TIM application steps at system-level integration, reducing assembly complexity while maintaining optimal thermal performance.
Solution Approach 2:
The thermal interface material is applied and cured in advance during first-level assembly, before the IC die is integrated into the final system. This preliminary action ensures the TIM is already in place and optimized for thermal contact, simplifying subsequent system-level integration steps while achieving the best possible thermal performance.
2Reliability
If thermal interface material qualification is performed for each new IC die, then thermal performance reliability is improved, but time and labor consumption increase
Solution Approach 1:
The IC die supplier performs TIM application and curing as a preliminary step during first-level assembly, before the IC die reaches the system-level integrator. This allows the IC die supplier to qualify and optimize the TIM for each specific IC die type in advance, ensuring thermal performance reliability while preventing time and labor consumption at the system-level integration stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures consistent thermal performance and allows for the use of high-performing TIMs without complicating the assembly process, as the TIM integration with the IC die surface becomes fixed, with only the interface to the thermal solution varying during subsequent application.
Implementation Method 1
thermal interface material (TIM) that makes contact with a thermal solution, to transport heat generated during operation of the IC die
Implementation Method 2
an adhesive bond or a fusion bond physically couples the TIM to a surface of the stiffener
Implementation Method 3
an adhesive bond or a fusion bond physically couples the TIM to a surface of the stiffener
Data Source
AI summary
A second-level thermal interface material (TIM2) that is to couple to a system-level thermal solution is applied to an integrated circuit (IC) assembly comprising an IC die and an assembly substrate prior to the assembly substrate being joined to a host component at the system-level. Challenges associated with TIM2 application may therefore be addressed at a first level of IC die integration, simplifying subsequent assembly and better controlling thermal coupling to a subsequently applied thermal solution. Where a first-level IC assembly includes a stiffener, the TIM may be affixed to the stiffener through an adhesive bond or a fusion bond. After the IC assembly including the TIM is soldered to the host board, a thermal solution may be placed in contact with the TIM. With early application of a solder TIM, a solder TIM may be reflowed upon the IC die multiple times.