Transparent Substrate Photovoltaic Diodes Integrated Circuit

The patent merges the photovoltaic cell and integrated circuit into a single monolithic structure fabricated on the same semiconductor substrate. The PV cell layers (including n-type and p-type doped regions) are integrated directly with the IC circuit layers, eliminating the need for external wiring, gates, contacts or terminals. This consolidation simplifies manufacturing by using standard semiconductor fabrication processes and ensures light exposure is automatically achieved through the substrate's transparent nature.

The patent performs preliminary action by fabricating both the photovoltaic cell structure and integrated circuit structure simultaneously on the same semiconductor substrate during the same manufacturing process sequence. The PV cell layers are formed first (including transparent conductive oxide, n-type doped layers, intrinsic layers, and p-type doped layers), followed by the IC circuit layers. This preliminary integration eliminates subsequent connection steps and ensures optimal light exposure pathways are established during fabrication.

The patent applies local quality by making the substrate itself transparent to light in the spectral range relevant to the photovoltaic cell's sensitivity. The substrate is engineered with specific optical properties (transparency) while maintaining its mechanical and electrical functions. This localized optical property enhancement allows light to pass through the substrate and reach the PV cell's light-sensitive portions without requiring complex manufacturing constraints or special handling during fabrication.