Power Module Heat Dissipation Structure for Shorter Thermal Paths
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Solution Overview
Problem
The existing power modules face inefficiencies in heat dissipation due to a long heat conduction path, leading to poor heat dissipation efficiency and potential thermal stress issues that can cause warpage, cracking, or delamination of the ceramic substrate, affecting performance and reliability.
Innovation Solution
A power module design featuring a patterned insulation thermally conductive layer between power devices and a heat dissipation device with a heat dissipation plate and base, where the heat dissipation plate has a chamber with heat dissipation bumps, reducing the heat conduction path and distributing heat evenly to prevent local hot spots, and utilizing a working fluid for enhanced heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat is conducted sequentially through multiple layers (upper copper foil, intermediate ceramic layer, lower copper foil, solder layer, metal baseplate, and thermal interface material layer), then the heat can be transferred from power devices to heat dissipator, but the heat conduction path becomes long and heat dissipation efficiency deteriorates
Solution Approach 1:
The heat dissipation device is segmented into multiple functional components: heat dissipation fins arranged in arrays, heat dissipation plates with chambers, and heat dissipation bumps. This segmentation creates multiple parallel heat conduction paths and increases the overall heat dissipation surface area, effectively reducing the thermal resistance and improving heat dissipation efficiency without requiring a longer conduction path.
Solution Approach 2:
The patent transitions from a one-dimensional sequential heat conduction path through multiple layers to a multi-dimensional heat dissipation structure. Heat dissipation fins extend in multiple directions, creating a three-dimensional heat dissipation network that increases the heat exchange surface area with the surrounding environment, thereby improving heat dissipation efficiency without extending the conduction path length.
2Power
If multiple power devices are disposed on the ceramic substrate, then the power module can provide higher power output, but multiple hot spots are formed due to local concentration or accumulation of heat
Solution Approach 1:
The heat dissipation device segments the heat dissipation function into multiple independent heat dissipation units (fins, plates, and bumps) distributed across the substrate. Each unit independently handles heat from nearby power devices, preventing heat accumulation at single locations and effectively managing multiple hot spots while maintaining high power output capability.
Solution Approach 2:
The heat dissipation structure employs local quality by positioning specific heat dissipation components (such as heat dissipation bumps and plates) in proximity to power devices that generate higher heat. This localized heat dissipation approach optimizes the thermal management for each hot spot region while maintaining overall system power output.
3Reliability
If heat cannot be quickly discharged outside, then the power module can maintain structural integrity, but thermal stress causes warpage, cracking, or delamination of the intermediate ceramic layer
Solution Approach 1:
The heat dissipation device performs preliminary heat dissipation action by providing multiple heat dissipation paths and large surface area heat exchange structures. This preliminary heat removal prevents excessive temperature rise and thermal stress accumulation before they can cause warpage, cracking, or delamination, thereby protecting the structural integrity of the ceramic substrate while maintaining reliability.
Solution Approach 2:
The heat dissipation device acts as an intermediary thermal management system between the power devices and the environment. It provides multiple heat conduction paths and large surface area heat exchange structures that facilitate efficient heat transfer, reducing thermal stress on the ceramic substrate and preventing thermal stress-related failures while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat dissipation efficiency, reduces module thickness, and prevents thermal stress-related issues, enhancing the reliability and performance of the power module by shortening the heat conduction path and distributing heat evenly.
Implementation Method 1
The heat generated by the power devices during operation is conducted to the heat dissipator sequentially through the upper copper foil, the intermediate ceramic layer, the lower copper foil, the solder layer, the metal baseplate, and the thermal interface material layer
Implementation Method 2
utilizing a working fluid for enhanced heat exchange
Implementation Method 3
the heat is exchanged between the heat dissipator and cold air to discharge the heat
Data Source
AI summary
A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.