Two-Piece Lid Structure for 3DIC Heat Dissipation
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Solution Overview
Problem
Heat dissipation in Three-Dimensional Integrated Circuits (3DICs) is inefficient due to challenges in effectively dissipating heat generated in the inner dies, which affects the performance and reliability of High Performance Computing applications.
Innovation Solution
A two-piece lid structure is implemented, comprising a mechanical enhanced lid attached to the substrate for stress compensation and a thermal enhanced lid attached to the package components using a thermal interface material and phase change adhesive, optimizing both mechanical and thermal performance for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single lid structure is used, then the device complexity is low, but the heat dissipation performance is insufficient
Solution Approach 1:
The lid structure is divided into two separate components: a mechanical enhanced lid and a thermal enhanced lid. The mechanical enhanced lid provides structural support and stress compensation, while the thermal enhanced lid focuses on heat dissipation functionality. This segmentation allows each lid to be optimized for its specific function, resolving the contradiction between structural simplicity and thermal performance.
2Temperature
If thermal interface material is added between the lid and package components, then the heat dissipation improves, but the manufacturing complexity increases
Solution Approach 1:
A thermal interface material is introduced as an intermediary substance between the thermal enhanced lid and the package components (semiconductor dies, interposer, and substrate). This intermediary material fills microscopic gaps and improves thermal contact, significantly reducing thermal resistance. The phase change adhesive serves as another intermediary that ensures reliable bonding while maintaining thermal conductivity.
3Temperature
If a two-piece lid structure is implemented, then the thermal performance improves by 20%-80%, but the device complexity increases
Solution Approach 1:
Different regions of the lid structure are assigned different qualities and functions. The mechanical enhanced lid primarily covers and protects the package components, providing mechanical strength. The thermal enhanced lid is specifically positioned to maximize thermal contact with heat-generating components, with thermal interface material applied locally at critical thermal pathways. This local quality differentiation optimizes thermal performance without requiring complete redesign of the entire lid structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The two-piece lid structure reduces thermal resistance by 20%-80%, enhancing heat dissipation and maintaining mechanical integrity, thereby improving the thermal performance of 3DICs in high power and high power density applications.
Implementation Method 1
a thermal interface material disposed between the second lid structure and the semiconductor package
Implementation Method 2
a phase change adhesive disposed between the second lid structure and the first lid structure
Data Source
AI summary
A package structure includes a substrate, a semiconductor package disposed over the substrate, a first lid structure disposed over the substrate, and a second lid structure disposed over the semiconductor package and the first lid structure. The first lid structure includes an opening exposing a region of the semiconductor package. A thermal interface material is disposed between the second lid structure and the semiconductor package, and a phase change adhesive is disposed between the second lid structure and the first lid structure.