Semiconductor Package Heat Path via Side-Coupled Metal Member
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Solution Overview
Problem
Mobile terminals and similar devices face challenges in achieving sufficient heat conduction between the mother substrate and the casing, leading to inadequate heat radiation performance from semiconductor chips, which results in performance degradation due to increased temperature.
Innovation Solution
A semiconductor package design that includes a module substrate with a metal member having a top portion and a side portion, thermally coupled to a metal film and via conductors, which forms a heat conduction path from the semiconductor chip to a heat sink, enhancing heat radiation performance by connecting the semiconductor chip directly to the casing through a thermal coupling member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is radiated mostly via the mother substrate, then the structure is simple, but the heat radiation performance is insufficient
Solution Approach 1:
The heat radiation function is segmented into multiple independent heat conduction paths: one through the module substrate to the mother substrate, and another through the metal member (heat sink) directly coupled to the semiconductor chip. This segmentation allows each path to contribute to heat dissipation without requiring complete redesign of the existing structure.
Solution Approach 2:
The metal member acts as an intermediary heat dissipation component between the semiconductor chip and the external environment. It provides a dedicated thermal conduction path that supplements the existing mother substrate path, enabling improved heat radiation performance without disrupting the original simple structure.
2Volume of moving object
If the semiconductor package is mounted on the mother substrate in a narrow space, then the device size is compact, but sufficient heat radiation through air convection cannot be ensured
Solution Approach 1:
The solution transitions from relying solely on planar heat conduction through the mother substrate to incorporating a vertical/three-dimensional heat dissipation structure. The metal member extends upward from the module substrate, creating additional surface area in the vertical dimension for heat radiation, thereby overcoming the limitations of narrow horizontal space.
Solution Approach 2:
The invention introduces an additional heat conduction path that copies and supplements the function of the mother substrate. The metal member replicates the heat dissipation function alongside the existing substrate path, providing redundant thermal management capability within the compact form factor.
3Power
If output power and operating frequency are increased, then the performance is improved, but the amount of heat generated by transistors increases
Solution Approach 1:
The invention changes the thermal management parameters by introducing a metal member with high thermal conductivity directly coupled to the semiconductor chip. This parameter change in the heat conduction path enables the system to handle higher power levels and frequencies by providing enhanced heat dissipation capability that scales with increased power generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal resistance and suppresses excessive temperature increases in semiconductor chips, thereby improving heat radiation performance and preventing performance degradation due to self-heating.
Implementation Method 1
heat generated by the semiconductor chip is conducted to the mother substrate through the module substrate and is radiated from the mother substrate
Implementation Method 2
heat from a semiconductor chip is radiated mostly via a mother substrate
Implementation Method 3
it is difficult to ensure a sufficient amount of heat radiation through air convection
Data Source
AI summary
A semiconductor package includes a module substrate having opposite top and bottom surfaces, a semiconductor chip provided with bumps and mounted on the top surface of the module substrate via the bumps, and a metal member having a top portion disposed at a level higher than the semiconductor chip with reference to the top surface of the module substrate and including the semiconductor chip in plan view and a side portion extending from the top portion toward the module substrate. The module substrate includes a first metal film disposed on or in at least one of the bottom surface and an internal layer of the module substrate. The first metal film is electrically connected to the bumps and reaches a side surface of the module substrate. The side portion is thermally coupled to the first metal film at the side surface of the module substrate.