Heat Slug Lid Base Adhesion via Indentation Design
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges with package warpage, lack of adhesive coverage, and lower adhesion strength between heat slugs and lids, leading to thermal interface material-related issues such as tilt and overflow, which affect the reliability and longevity of semiconductor packages.
Innovation Solution
The introduction of a lid design with a base indentation and a heat slug having a non-horizontal side partially within the indentation, along with a thermally conductive adhesive layer, enhances adhesion strength and prevents overflow, ensuring improved reliability and heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional packaging structures are used, then manufacturing is simpler, but adhesion strength between heat slug and lid is insufficient and overflow occurs
Solution Approach 1:
The lid base is segmented into multiple functional regions: a recess portion that receives the heat slug, a base indentation that provides adhesive retention, and a rim that contains thermal interface material. This segmentation allows each region to perform its specific function optimally while collectively solving the adhesion and overflow problems.
Solution Approach 2:
The base indentation is pre-formed in the lid base before heat slug attachment. This preliminary structural feature ensures that adhesive is properly retained and distributed in the correct location, preventing overflow and ensuring strong adhesion from the outset without requiring complex additional components.
2Volume of moving object
If miniaturization is pursued, then package size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The lid base provides enhanced heat conduction locally at the critical interface between the heat slug and lid through the recess portion and base indentation design. This localized thermal management ensures efficient heat dissipation from the integrated circuit despite the overall miniaturization of the package, as the heat path is optimized at the most critical thermal interface.
3Strength
If adhesive coverage is increased, then adhesion strength improves, but manufacturing precision requirements increase
Solution Approach 1:
The base indentation structure serves itself by providing built-in adhesive retention through its geometric design. The recess portion and base indentation work together to automatically contain and distribute adhesive evenly, eliminating the need for highly precise adhesive application processes while ensuring complete adhesive coverage for strong adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves improved adhesion strength of at least 80% adhesive coverage, eliminates interfacial anomalies, and effectively conducts heat away from integrated circuits, addressing the limitations of conventional methods.
Implementation Method 1
The base-slug adhesive layer 144 can be thermally conductive and can be attached to a top extent of the recess portion and facing the heat slug
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.