OLED Bonding Pad Barrier Structure for Copper Line Oxidation
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Solution Overview
Problem
Conventional OLED display panel bonding lines made of copper-based materials are prone to oxidation, affecting conductivity and rendering them unsuitable for direct use as metal pads.
Innovation Solution
A display panel design featuring a bonding pad with a thin film for blocking moisture and oxygen, positioned on the bonding line, which includes multiple layers such as indium tin oxide, aluminum, and metal oxides to prevent oxidation, allowing for the use of copper-based materials without compromising conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper-based material is used for bonding lines, then conductivity is improved, but oxidation resistance deteriorates
Solution Approach 1:
The bonding pad is constructed as a composite structure with a copper-based first bonding part (for conductivity) and an oxide layer on its surface (for oxidation resistance). This composite structure allows the bonding line to maintain high conductivity while preventing oxidation, resolving the contradiction between conductivity and oxidation resistance.
2Object-affected harmful factors
If additional protective layers are added to prevent oxidation, then oxidation resistance is improved, but device complexity increases
Solution Approach 1:
The oxide layer that prevents oxidation is merged with the bonding pad structure itself, forming an integrated bonding pad rather than a separate protective layer. This merging approach provides oxidation protection while minimizing structural complexity, as the protective function is built into the bonding pad's own composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents oxidation of copper-based bonding lines, ensuring stable conductivity and simplifying the manufacturing process by eliminating the need for additional protective layers, thereby reducing costs and improving yield rates.
Implementation Method 1
the bonding pad comprises a thin film for blocking moisture and oxygen
Data Source
AI summary
A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, a TFT structure, a bonding line, a bonding pad, and a luminescent functional layer. The substrate includes a display area and a pad area. The TFT structure is disposed on the substrate in the display area. The bonding line is disposed on the substrate in the pad area. The bonding pad is disposed on a side of the bonding line away from the substrate. The bonding pad includes a thin film for blocking moisture and oxygen. The luminescent functional layer is disposed on a side of the TFT structure away from the substrate. The thin film for blocking moisture and oxygen is disposed on the bonding line, thereby blocking moisture and oxygen from corroding the bonding line.