Semiconductor Apparatus Partition Prevents Die Bonding Paste Ooze
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Solution Overview
Problem
The existing semiconductor light emitting apparatus experiences poor connection between the bonding wire and the substrate due to the oozing of die bonding paste, which affects the reliability of the electrical connection.
Innovation Solution
A semiconductor apparatus is designed with a substrate, semiconductor chip, connection material, bonding wires, and partitions on the substrate to prevent the oozing of the connection material, ensuring a stable bond between the semiconductor chip and the substrate by using partitions to contain the die bonding paste and maintain a secure connection between the bonding wires and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If die bonding paste is applied to connect the semiconductor light emitting element and the conductive portion, then the connection between the semiconductor chip and substrate is achieved, but the die bonding paste may ooze out to the conductive portion connected to the wire, causing poor connection
Solution Approach 1:
The patent introduces a partition structure that divides the substrate surface into separate regions: a first region for die bonding paste application and a second region for wire connection. This segmentation prevents the die bonding paste from spreading to the wire connection area, thereby maintaining both connection strength and connection reliability without compromise
2Strength
If die bonding paste is applied generously to ensure good bonding, then the bonding between semiconductor chip and substrate is improved, but the paste spreads to the wire connection area causing poor wire connection
Solution Approach 1:
By segmenting the substrate surface into distinct functional regions with a partition, the patent allows generous application of die bonding paste in the first region without concern for spread to the wire connection area (second region), thus maintaining bonding strength while preserving wire connection quality
Solution Approach 2:
The partition acts as an intermediary barrier between the die bonding paste application area and the wire connection area. This intermediary structure contains the paste within its designated region, preventing unwanted spread while allowing both processes to proceed effectively
Data Source
AI summary
Provided is a semiconductor apparatus including a substrate, a semiconductor chip, a connection material, a bonding wire, and a partition, in which the semiconductor chip is arranged on the substrate through the connection material, the bonding wire includes a first end and a second end and is connected to the semiconductor chip at the first end and connected to the substrate at the second end, and the partition is arranged on the substrate, at a position between the semiconductor chip and the second end in plan view.