Semiconductor Seal Ring Layout for Moisture Blocking and Noise Isolation
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Solution Overview
Problem
Integrated circuits are vulnerable to moisture and ionic contaminants at their periphery due to exposed areas between chips, which can affect operational reliability and lead to microcracking during the sawing process.
Innovation Solution
The implementation of a semiconductor device design featuring a closed-loop outer seal ring and a gapped inner seal ring, where the outer seal ring provides continuous structural reinforcement and protection against moisture and contaminants, while the inner seal ring breaks noise-coupling paths with strategically placed gaps to isolate noise from high-frequency circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If seal rings are added to protect the periphery, then reliability is improved, but device complexity increases
Solution Approach 1:
The seal rings serve multiple functions simultaneously: they provide structural reinforcement to the chip edges, act as barriers against moisture and ionic contaminants, and enhance mechanical strength during the sawing process. This multi-functionality allows a single structural element to address multiple reliability concerns without proportionally increasing complexity
Solution Approach 2:
The seal ring structure merges several protective functions into a single integrated component. Rather than adding separate elements for structural support, moisture protection, and contaminant blocking, the metal band combines these functions, reducing the overall complexity that would result from multiple separate protective structures
2Productivity
If the wafer is sawed into individual chips, then productivity is improved, but microcracking occurs during the process
Solution Approach 1:
The seal rings are formed on the chip periphery before the wafer sawing process. These metal bands provide预先 reinforcement and structural cushioning to the fragile chip edges, absorbing and distributing mechanical stresses during the sawing operation to prevent microcracking from developing in the active circuitry regions
Data Source
AI summary
A device includes an outer seal ring, an integrated circuit, and an inner seal ring. The outer seal ring forms a first closed loop. The integrated circuit is surrounded by the outer seal ring. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring forms a second closed loop that defines an enclosed region external to the integrated circuit.