Wiring Board Layout for Heat Dissipation Without Via Overheating
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Solution Overview
Problem
Conventional wiring boards face challenges in efficient heat dissipation and long-term reliability due to heat transfer issues between electronic components and heat dissipation portions, leading to potential disconnection at connection points over time.
Innovation Solution
A wiring board design featuring an insulating substrate with via conductors at corner portions, wiring conductors connecting mounting and via conductors, and a heat dissipation portion positioned to overlap the mounting area, with specific regions on the substrate configured to enhance heat transfer to the heat dissipation portion, using materials like copper-tungsten for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation portion is positioned to overlap mounting area, then heat dissipation efficiency is improved, but heat transfer to via conductors increases causing connection disconnection
Solution Approach 1:
The patent introduces a heat dissipation portion as an intermediary element positioned between the electronic component and the via conductor. This mediator absorbs and conducts heat away from the component while preventing direct heat transfer to the via conductor, thus resolving the contradiction between heat dissipation efficiency and connection reliability
Solution Approach 2:
The patent extracts the heat dissipation function from the via conductor and creates a separate dedicated heat dissipation portion. This separation allows the via conductor to maintain its electrical connection function while the heat dissipation portion handles thermal management, preventing the harmful heat transfer to the via conductor
2Reliability
If wiring conductor connects mounting portion and via conductor, then electrical connectivity is improved, but heat transfer path to via conductor is created
Solution Approach 1:
The patent applies different material properties to different parts of the wiring structure. The wiring conductor is designed with specific thermal and electrical properties that allow it to conduct electricity while minimizing heat transfer to the via conductor, creating local quality differentiation in the thermal management system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses heat transfer to via conductors, facilitating efficient heat dissipation and reducing the risk of disconnection at connection points, thereby enhancing the long-term reliability and functionality of electronic devices.
Implementation Method 1
a heat dissipation portion located inside the insulating substrate at a position overlapping the mounting portion in a plane perspective view
Data Source
AI summary
A wiring board includes an insulating substrate including a first surface and a mounting portion for an electronic component on the first surface, the insulating substrate having a rectangular shape in a plan view of the first surface; a via conductor located inside the insulating substrate and at a corner portion of the insulating substrate in a plane perspective, and extending in a thickness direction of the insulating substrate; a wiring conductor located on the first surface and connecting the mounting portion and the via conductor to each other; and a heat dissipation portion located inside the insulating substrate at a position overlapping the mounting portion in a plane perspective view, wherein the first surface includes, between the heat dissipation portion and the via conductor in a plane perspective view, a first region surrounded by the wiring conductor in a plan view.