Memory Cell Column Geometry for Stable Stacked Body Replacement

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Solution Overview

Problem

In the manufacturing of semiconductor devices, the collapse of stacked bodies during the replacement of sacrificial films with semiconductor layers is a significant challenge, particularly as the technology advances and dimensions are downscaled, leading to reduced manufacturing yield and stability issues.

Innovation Solution

The semiconductor device design incorporates columnar parts with varying diameters to provide structural support, where the diameter of these parts within the semiconductor part is larger than within the stacked body, preventing collapse by maintaining stability during the replacement process and enhancing manufacturing yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the stacked body is downscaled to advance semiconductor technology, then device integration and capacity are improved, but structural stability deteriorates leading to collapse during manufacturing

Engineering Contradiction:

Improvestacked body dimensionsVSAvoidstructural stability

Core Design Contradiction:

Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The stacked body is divided into multiple segments with insulating films and conductive films stacked alternately, creating a modular structure that maintains stability during downsaling. The segmentation allows each layer to support itself independently, preventing overall collapse

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Columnar parts are strategically positioned at specific locations within the stacked body to provide localized structural support. These columnar parts have different properties (larger diameter) at specific locations to prevent collapse where it is most critical during the replacement process

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If sacrificial films are replaced with semiconductor layers to form source regions, then device functionality is improved, but manufacturing yield deteriorates due to stacked body collapse

Engineering Contradiction:

Improvedevice functionalityVSAvoidmanufacturing yield

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

Columnar parts are formed in advance before the replacement of sacrificial films with semiconductor layers. This preliminary structural support is in place to prevent collapse during the subsequent replacement process, ensuring manufacturing yield is maintained

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Columnar parts act as intermediary structural elements between the stacked body and the replacement process. They provide mechanical support that allows the sacrificial film replacement to proceed without causing collapse, mediating between the manufacturing process and structural integrity

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If columnar parts with larger diameter are provided within the semiconductor part, then structural support is improved preventing collapse, but device complexity increases

Engineering Contradiction:

Improvestructural supportVSAvoiddevice complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The columnar parts have different diameters at different locations - larger diameter within the semiconductor part where support is needed, and smaller diameter within the stacked body. This local variation provides strength exactly where required without unnecessarily increasing complexity throughout the entire structure

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The columnar parts extend in the height direction (vertical dimension) of the stacked body, providing structural support through the third dimension rather than expanding the planar footprint. This allows strength to be added without significantly increasing the device's planar complexity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11888041B2Nonvolatile semiconductor memory device including a memory cell

Publication Date: 2024.01.30 KIOXIA CORP

AI summary

A semiconductor device includes a base body, a stacked body on the base body and a first columnar part. The base body includes a substrate, a first insulating film on the substrate, a first conductive film on the first insulating film, and a first semiconductor part on the first conductive film. The stacked body includes conductive layers and insulating layers stacked alternately in a stacking direction. The first columnar part is provided inside the stacked body and the first semiconductor part. The first columnar part includes a semiconductor body and a memory film between the semiconductor body and conductive layers. The semiconductor body extends in the stacking direction. The first columnar part has a first diameter and a second diameter in a first direction crossing the stacking direction. The first diameter inside the first semiconductor part is larger than the second diameter inside the stacked body.