Micro-LED Display Subpixel Layout With Integrated Photodiode Sensing
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Solution Overview
Problem
Current micro-LED displays face challenges in integrating sensing capabilities without increasing production costs and space, as separate optical imaging modules are required for applications like proximity sensing and biometric authentication, limiting their functionality and efficiency.
Innovation Solution
Incorporating micro photodiodes into the display substrate alongside micro-LEDs, allowing for integrated sensing elements that share fabrication and packaging processes, enabling compact designs with enhanced sensing capabilities without additional modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate optical imaging modules are integrated into the display for sensing capabilities, then sensing functionality is improved, but device space and production complexity increase
Solution Approach 1:
The patent combines light emitting display subpixels and light capturing subpixels into a single integrated display structure. The light capturing subpixels are fabricated directly on the display substrate alongside the light emitting subpixels, eliminating the need for separate optical imaging modules. This merging approach maintains sensing functionality while reducing device complexity and production efforts.
Solution Approach 2:
The display substrate serves multiple functions: it acts as both the display surface for light emission and the sensing surface for light detection. The same substrate and fabrication processes are used for both light emitting diodes and photodiodes, creating a universal platform that performs both display and sensing operations without requiring separate specialized modules.
2Adaptability or versatility
If separate optical imaging modules are added for sensing, then sensing functionality is improved, but manufacturing costs increase
Solution Approach 1:
By merging the fabrication processes for light emitting subpixels and light capturing subpixels, the patent achieves economies of scale. Both types of subpixels are manufactured using the same semiconductor fabrication techniques on the same substrate, reducing per-unit costs compared to producing separate optical imaging modules through different manufacturing channels.
Solution Approach 2:
The universal fabrication approach uses identical process steps for creating both display and sensing elements, including photolithography, thin film deposition, and etching. This universality eliminates the need for separate production lines and reduces overall manufacturing costs while maintaining sensing capabilities.
3Area of stationary object
If micro photodiodes are integrated alongside micro-LEDs, then space efficiency is improved, but fabrication process complexity increases
Solution Approach 1:
The patent employs homogeneous fabrication processes for both micro-LEDs and micro photodiodes. The same material deposition techniques, patterning methods, and thermal processing steps are used for both device types, creating structural and procedural homogeneity that simplifies the overall fabrication process despite the presence of multiple subpixel types.
Solution Approach 2:
The display is segmented into distinct light emitting subpixels and light capturing subpixels that are spatially separated but fabricationally integrated. This segmentation allows each subpixel type to be optimized for its specific function while being manufactured through the same process flow, managing complexity through functional separation within a unified manufacturing approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration allows for seamless biometric authentication and proximity sensing within the display itself, reducing space and production costs while maintaining high pixel density and energy efficiency, resulting in more compact and functional mobile devices.
Implementation Method 1
Each light emitting display subpixel comprises a micro light emitting diode, micro-LED, and is configured to emit light for forming a portion of a display image
Implementation Method 2
Each light capturing subpixel comprises a micro photodiode and is configured to receive light that is emitted by at least a portion of the light emitting display subpixels and returned via reflection
Data Source
AI summary
A display includes a display substrate with a surface, on which pixels are formed by arranging a plurality of light emitting display subpixels and a plurality of light capturing subpixels on the surface of the display substrate. Each light emitting display subpixel comprises a micro-LED and each light capturing subpixels comprises a micro photodiode. The pixels are distributed across an active display area of the display substrate. At least a portion of the pixels include a light capturing subpixel and at least one light emitting display subpixel.