Dual-Sided Molded Package With Exposed Die for Heat Dissipation
Solution Overview
Problem
Dual-sided molded packages of circuit devices face challenges in thermal dissipation, particularly with the backside die generating heat that is not efficiently dissipated to the motherboard, leading to potential thermal management issues.
Innovation Solution
A dual-sided molded package module is designed with thermally conductive materials and interconnect members that directly dissipate heat from the backside die to the motherboard, utilizing posts and a bottom mold to facilitate this process, ensuring effective thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dual-sided molded package is used to increase integration, then device functionality is improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The package structure is segmented into distinct functional zones: the front die area, backside die area, and intermediate transfer region. This segmentation allows independent thermal management strategies for each die while maintaining electrical connectivity through the substrate, resolving the conflict between integrated functionality and thermal dissipation.
Solution Approach 2:
The substrate serves as an intermediary element between the front die and backside die, providing both electrical connectivity and thermal management pathways. The substrate's conductive layers and structural design enable heat transfer from both dies to the package exterior while maintaining signal integrity, thus mediating between functional integration and thermal dissipation requirements.
2Adaptability or versatility
If backside die is added to increase functionality, then device capability is improved, but heat generation increases
Solution Approach 1:
Different regions of the package are assigned different thermal properties: the substrate employs conductive materials in specific pathways to channel heat away from active die areas, while other regions maintain insulating properties to preserve electrical isolation. This localized differentiation of material properties enables simultaneous heat dissipation and electrical functionality.
Solution Approach 2:
The substrate's thermal and electrical parameters are optimized through material selection and layer configuration. By adjusting the conductivity, thickness, and composition of substrate layers, the package achieves optimal balance between heat transfer efficiency and electrical signal integrity, allowing the backside die to operate at higher power levels without compromising overall device performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal dissipation by allowing direct heat transfer from the die to the motherboard, improving the thermal management of circuit devices and preventing overheating.
Implementation Method 1
A thermally conductive layer is attached a bottom facing surface of the die, the thermally conductive layer extending through the mold and configured to couple to a motherboard. The thermally conductive layer is configured to dissipate heat from the die to the motherboard.
Data Source
AI summary
A dual-sided molded package module has a substrate, and a die and multiple posts attached to a bottom side of the substrate. A bottom mold surrounds and extends between the posts and the die. Electrically and thermally conductive interconnect members are attached to the posts and extend through the bottom mold. A thermally conductive layer is attached to a bottom facing surface of the die. The thermally conductive layer extends through the mold and couples to a motherboard (e.g., via solder material) so that the thermally conductive layer can dissipate heat from the die to the motherboard.