Stacked Semiconductor Package Thermal Sensing for TIM Degradation
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Solution Overview
Problem
In semiconductor packages with stacked chips, heat dissipation performance is compromised due to degradation of thermal interface materials, and existing temperature sensing methods often fail to detect deterioration of thermal conductive members in peripheral regions, leading to inadequate heat management.
Innovation Solution
A semiconductor package with multiple temperature sensors placed on the upper surface of stacked semiconductor chips, including both central and peripheral regions, to monitor temperature distribution and detect thermal conductive member deterioration, allowing for improved heat dissipation management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If one temperature sensor is provided on the central region, then the hot spot temperature can be monitored, but the deterioration of the thermal conductive member on the peripheral region cannot be detected
Solution Approach 1:
The temperature sensing function is segmented into multiple sensors positioned at different locations (central region and peripheral regions) on the semiconductor chip. This allows independent monitoring of different thermal zones, enabling detection of localized thermal conductive member deterioration in peripheral regions while maintaining overall temperature monitoring capability.
Solution Approach 2:
The temperature monitoring approach transitions from a single-point measurement (central region only) to a distributed spatial measurement network covering both central and peripheral regions. This dimensional expansion in sensor placement enables comprehensive thermal field mapping and detection of peripheral thermal conductive member degradation.
2Reliability
If multiple temperature sensors are added to monitor peripheral regions, then thermal conductive member deterioration can be detected, but the device complexity increases
Solution Approach 1:
Multiple temperature sensors serve dual purposes: they monitor both the central hot spot region and peripheral regions simultaneously, and they detect both operational temperature conditions and thermal conductive member deterioration. This multi-functionality reduces the need for separate monitoring systems and justifies the added sensor count.
Solution Approach 2:
The temperature sensors leverage the existing thermal field of the semiconductor device to perform self-diagnosis of thermal conductive member condition. By analyzing temperature distributions across different regions, the system automatically detects deterioration without requiring external inspection equipment or additional complex monitoring infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation by accurately detecting thermal conductive member deterioration in peripheral regions, ensuring effective heat transfer to cooling devices and maintaining optimal temperature control.
Implementation Method 1
a thermal conductive member provided between the uppermost semiconductor chip and the cooling device, and configured to transmit heat that is generated from the semiconductor package to the cooling device
Implementation Method 2
a cooling device provided on the semiconductor package and configured to absorb heat that is generated from the semiconductor package
Data Source
AI summary
A semiconductor package includes: a first semiconductor chip; a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, the plurality of second semiconductor chips including an uppermost semiconductor chip including a central region and a peripheral region at a periphery of the central region; at least one first temperature sensor provided on an upper surface of the uppermost semiconductor chip in the central region; a plurality of second temperature sensors provided on the upper surface in the peripheral region; and a thermal conductive member provided on the uppermost semiconductor chip and covering the at least one first temperature sensor and the plurality of second temperature sensors.