Chip Package Side Protection for Die Edge Cracking and Heat Dissipation
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Solution Overview
Problem
Conventional flip chip packaging technologies fail to adequately protect the die from damage due to exposure of edges and corners, leading to potential cracking under stress or vibration, and insufficient heat dissipation.
Innovation Solution
A chip package design featuring a high-thermally-conductive first protection structure that wraps the side surfaces of the die, ensuring edges and corners are covered, and a second protection structure between the die and substrate to mitigate stress differences, along with a blocking structure to prevent moisture and impurity contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bottom filling agent is used to fill the space under the die, then the die can be supported and positioned, but the edges and corners of the die remain exposed and unprotected
Solution Approach 1:
The patent transitions from two-dimensional planar filling (bottom filler only) to three-dimensional multi-layer protection by adding side protection structures that wrap around the die edges and corners, creating a comprehensive protective envelope that addresses the exposure problem in the vertical dimension
Solution Approach 2:
The patent implements nested protection layers where the side protection structure is embedded within or adjacent to the bottom filler, and both are enclosed by the molding compound, creating a multi-layer nested protective system that maximizes protection while minimizing overall package volume
2Temperature
If the die is exposed to improve heat dissipation access, then heat can be dissipated more effectively, but the die becomes vulnerable to damage from stress and vibration
Solution Approach 1:
The patent applies different protective qualities to different regions of the die: the top surface remains exposed for heat dissipation, while the edges and corners receive enhanced protection from the side protection structure, creating localized protection where it is most needed without compromising thermal performance
Solution Approach 2:
The patent employs composite protective structures combining the bottom filler material, side protection structure material, and molding compound to create a multi-material protective system that provides both mechanical strength and thermal management capabilities
3Reliability
If the die is fully enclosed for maximum protection, then the die is well-protected from damage, but heat dissipation capability is reduced
Solution Approach 1:
The patent implements differential protection where the top surface of the die remains exposed for optimal heat dissipation, while the vulnerable edges and corners are selectively protected by the side protection structure, achieving localized protection without compromising overall thermal performance
Solution Approach 2:
The side protection structure acts as a flexible protective shell that wraps around the die edges and corners, providing mechanical protection while maintaining a compact form factor that does not significantly impede heat dissipation pathways
4Device complexity
If the edges and corners of the die are exposed, then the package structure is simpler, but the die is susceptible to cracking under stress or vibration
Solution Approach 1:
The patent adds protection in the vertical dimension by introducing side protection structures that wrap around the die edges and corners, moving beyond traditional two-dimensional planar filling to three-dimensional multi-directional protection that effectively shields against stress and vibration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the reliability and safety of the die by preventing damage from stress and vibration while improving heat dissipation capabilities, ensuring complete protection and increased manufacturing efficiency.
Implementation Method 1
a high-thermally-conductive first protection structure that wraps the side surfaces of the die
Implementation Method 2
The bottom filler 6 is formed by adding a bottom filling agent under the die 2 and within a limited volume range of the dam 7 and solidifying the bottom filling agent
Data Source
AI summary
The technology of this application relates to a chip package that includes a substrate, a die, a first protection structure, and a blocking structure. The first protection structure wraps a side surface of the die, the blocking structure wraps a surface that is of the first protection structure and that is away from the die, and a first surface of the die, a first surface of the first protection structure, and a first surface of the blocking structure are flush. The first surface of the die is a surface that is of the die and that is away from the substrate, the first surface of the first protection structure is a surface that is of the first protection structure and that is away from the substrate, and the first surface of the blocking structure is a surface that is of the blocking structure and that is away from the substrate.