ECU Circuit Board Layout for Thermal Isolation Between Components
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Solution Overview
Problem
In-vehicle electronic control devices with resin composite housings face challenges in heat dissipation due to lower thermal conductivity, leading to increased thermal interference and temperature rises among electronic components.
Innovation Solution
The electronic control device incorporates a circuit board with through holes or concave portions between mounting regions of adjacent electronic components, which blocks horizontal heat transfer paths while maintaining vertical heat dissipation, reducing thermal interference and temperature rises.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a resin composite housing is used instead of a metal housing for weight reduction, then the weight of the device is reduced, but the thermal conductivity decreases causing insufficient heat dissipation and thermal interference between electronic components
Solution Approach 1:
The circuit board is segmented with through holes or concave portions arranged between mounting regions of heat-generating electronic components. This segmentation creates thermal isolation zones that block horizontal heat transfer paths through the circuit board, preventing thermal interference between adjacent components while maintaining the lightweight resin composite housing structure.
2Speed
If multiple heat-generating electronic components are arranged close to each other for high-speed transmission, then the functionality and transmission speed are improved, but thermal interference between components increases causing temperature rise
Solution Approach 1:
Through holes or concave portions are introduced into the circuit board between adjacent mounting regions to segment the thermal conduction path. This allows electronic components to be arranged closely for high-speed transmission while the segmented structure blocks horizontal heat transfer, preventing thermal interference and temperature rise.
Solution Approach 2:
The circuit board is designed with different local structures: solid regions under heat-generating components for vertical heat dissipation, and through holes or concave portions between components to block horizontal heat transfer. This local quality differentiation enables both close component arrangement and thermal isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses temperature rises by blocking horizontal heat transfer and securing vertical heat dissipation paths, thereby improving thermal management and reducing thermal interference between electronic components.
Implementation Method 1
The circuit board includes N (N is an integer of 2 or more) through holes or concave portions arranged between a mounting region of the first electronic component and a mounting region of the second electronic component
Implementation Method 2
a heat-generating electronic component is thermally connected to a heat dissipation block provided in a housing or the like via a heat dissipation member to dissipate heat
Data Source
AI summary
A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).