Vertical Interconnect Elevator for 3D FPGA-HBM TSV Packaging

The system is divided into multiple functional components: FPGA IC chip for logic functions, HBM IC chip for memory, and auxiliary IC chips for specialized functions. Each component is optimized independently and integrated through TSV interconnects, allowing the FPGA to maintain flexibility while offloading storage and specialized tasks to dedicated components.

The patent transitions from traditional 2D planar packaging to 3D vertical stacking architecture. Multiple IC chips are stacked in the vertical dimension and interconnected through Through-Silicon Vias, enabling high-density integration and reduced footprint while maintaining design flexibility through the programmable FPGA component.

The FPGA IC chip serves multiple functions: general-purpose logic implementation, configuration storage, and interconnect routing. Auxiliary IC chips provide specialized functions that can be shared across multiple applications. This multi-functionality reduces the need for custom ASIC designs, lowering NRE costs while maintaining high integration density through standard manufacturing processes.

The patent introduces auxiliary IC chips as intermediary components between the FPGA and HBM, providing specialized functions such as memory control, I/O interfacing, and signal conditioning. These standardized intermediary components enable the system to leverage advanced technology nodes for performance-critical paths while using mature, cost-effective processes for less demanding functions.

The HBM IC chip is nested vertically on top of the FPGA IC chip, with multiple memory stacks integrated within a compact footprint. This nested 3D architecture enables high bandwidth and fast memory access by placing memory directly over compute logic, while the modular nested structure facilitates standardized manufacturing processes.

The patent introduces dedicated TSV interconnect structures and auxiliary IC chips as intermediaries between the HBM and FPGA. These intermediary elements manage the complex signaling and data flow between stacked components, enabling high-speed memory access while abstracting the manufacturing complexity through standardized interconnect interfaces and modular assembly procedures.