Power Assembly Thick Conductive Layers With Pre-Drilled Vias
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Solution Overview
Problem
Current power module packaging technologies face limitations in thermal enhancement, volume reduction, and reliability due to high parasitic levels and low reliability of traditional wire bonding methods, and the costly process of achieving thick copper layers for improved thermal and electrical performance.
Innovation Solution
A power assembly with a multilayer base structure featuring internal and external conductive layers, where pre-drilled holes in the external conductive layers are filled with conductive material to form vias, enhancing thermal and electrical connectivity while overcoming drilling limitations and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional plating method is used to achieve thick external electrically conductive layers, then thermal and electrical performance is improved, but manufacturing cost increases and process time is extended
Solution Approach 1:
The patent applies preliminary action by pre-drilling holes in the external electrically conductive layers before lamination. This allows the holes to be formed when the material is in a more accessible state, avoiding the need to drill through already-laminated thick conductive layers. The pre-drilled holes are then filled with conductive material during subsequent processing steps, achieving the required thick conductive layers with reduced manufacturing complexity and cost.
2Reliability
If thick external electrically conductive layers are formed before drilling vias, then thermal and electrical performance is improved, but laser drilling capability is exceeded
Solution Approach 1:
The patent resolves this contradiction by performing the hole drilling action preliminarily, before the conductive layers reach their final thick configuration through lamination. By pre-drilling holes in the external conductive layers at an earlier stage when material thickness is reduced, the process remains within laser drilling capabilities while still achieving thick final conductive layers after lamination and filling operations.
3Ease of operation
If traditional wire bonding method is used to connect power die, then ease of connection is achieved, but parasitic level increases and reliability decreases
Solution Approach 1:
The patent extracts and eliminates the wire bonding intermediate connection element from the traditional power die connection method. Instead of using wire bonds to connect power dies to the substrate, the invention directly integrates power dies onto the substrate with conductive layers, removing the wire bonding step entirely. This extraction of the wire bonding element reduces parasitic inductance and resistance while improving connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced thermal dissipation and power transmission with thick external conductive layers, improving reliability and reducing manufacturing complexity and costs by using mechanical drilling for pre-drilled holes in the conductive layers.
Implementation Method 1
The holes are filled with a conductive material in order to form vias connecting the contact pads of the internal electrically conductive layer to the external electrically conductive layer
Implementation Method 2
providing better current and thermal transfer of the power device
Data Source
AI summary
An electrical power assembly, comprising: at least one multilayer base structure, at least one power device embedded in the at least one multilayer base structure, an internal electrically conductive layer positioned on each side of the multilayer base structure, the internal electrically conductive layer being connected to a respective electrical contact of the power device through connections arranged in the multilayer base structure; at least one external electrically conductive layers positioned on each side of the base structure, each external electrically conductive layer comprising at least one pre-drilled through hole, at least one internal electrically insulating layer positioned between the internal electrically conductive layer of the base structure and a respective external electrically conductive layer, at least one hole arranged in the internal electrically insulating layer and the external electrically conductive layer, a portion of each hole being formed by the pre-drilled through hole, the at least one hole being filled with electrically conductive material to form external conductive vias to connect the internal electrically conductive layer to the respective external electrically conductive layer.