Semiconductor Package Testing via Non-Contact Microbump Field Sensing
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Solution Overview
Problem
Current semiconductor testing methods require physical contact with bumps or pads, leading to increased costs and the discarding of non-defective components due to contact issues during assembly, and are unable to effectively test components that are difficult to contact.
Innovation Solution
A semiconductor test device that uses a test circuit embedded in the semiconductor chip to emit an electrical field from microbumps or pads, detected by a sensor without physical contact, allowing for the determination of contact failures and package defects through electrical field waveform analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical contact testing method is used with bumps or pads, then testing can be performed, but testing costs increase and non-defective components are discarded due to contact issues
Solution Approach 1:
The patent replaces the mechanical contact-based testing system with an electromagnetic field-based sensing system. Sensors detect electrical fields generated by test circuits through microbumps without physical contact, eliminating mechanical wear and contact-related failures that cause discarding of non-defective components.
Solution Approach 2:
The patent introduces an intermediary electromagnetic field as a mediator between the test circuit and the sensor. The test circuit generates electrical fields that propagate through the microbumps to external electrodes, where sensors detect them without direct contact, enabling indirect measurement that avoids contact issues.
2Reliability
If physical contact testing method is used, then testing can be performed, but testing costs increase
Solution Approach 1:
The patent replaces expensive mechanical contact testing equipment with electromagnetic field sensing systems. This substitution reduces wear and tear on testing equipment, extends device lifespan, and lowers maintenance costs while maintaining testing accuracy.
Solution Approach 2:
The patent creates an electromagnetic field copy or representation of the electrical signals within the microbumps. Sensors detect these field copies externally, eliminating the need for direct physical access to internal components and reducing complex mechanical testing apparatus requirements.
3Reliability
If physical contact testing is attempted on difficult-to-reach components, then testing coverage can be improved, but contact issues and component damage increase
Solution Approach 1:
The patent replaces mechanical probing with electromagnetic field detection, enabling testing of difficult-to-reach components without physical access. The electromagnetic fields can penetrate through封装 materials and be detected from external locations, eliminating mechanical damage risks.
Solution Approach 2:
The patent uses electromagnetic fields as intermediaries to transmit test signals to and from difficult-to-reach components. The fields act as carriers that can traverse through packaging materials and reach internal microbumps without requiring physical contact with the components themselves.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables early detection of defective components during assembly, reduces costs by avoiding unnecessary component discarding, and allows for non-contact testing of difficult-to-reach components, improving product reliability and customer satisfaction.
Implementation Method 1
controlling a test circuit included in the semiconductor chip to cause emission of an electrical field from at least a set of microbumps among microbumps connected to the semiconductor package; using a sensor disposed above an upper surface of the microbumps and spaced apart therefrom by a predetermined interval, to detect the electrical field emitted from the one or more microbumps of the set of microbumps
Data Source
AI summary
A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.