Flexible Semiconductor Package Heat Dissipation Resin Layer
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Solution Overview
Problem
Existing semiconductor packages, particularly those used in high-definition displays, face challenges with excessive heat generation due to low thermal conductivity in flexible insulating substrates and the inflexibility introduced by metal heat dissipation members, which can lead to degraded performance and reliability.
Innovation Solution
A semiconductor package design incorporating a flexible insulating substrate with first and second wirings, vias coupling these wirings, semiconductor devices, solder bumps, and a heat dissipation resin layer made of a thermally conductive polymer compound including a thermally conductive filler and epoxy-based or silicon-based thermosetting polymer, which efficiently dissipates heat while maintaining flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal heat dissipation member is used, then heat dissipation efficiency is improved, but flexibility of the package decreases
Solution Approach 1:
The patent changes the material parameter from metal to polymer compound, and changes the thermal conductivity parameter by incorporating thermally conductive fillers into the polymer matrix, achieving both flexibility and heat dissipation
Solution Approach 2:
The patent uses a composite material consisting of polymer compound as the base matrix with thermally conductive fillers dispersed within it, combining the flexibility of polymer with the thermal conductivity of filler materials to resolve the contradiction between flexibility and heat dissipation efficiency
2Temperature
If the thermal conductivity of flexible insulating substrate is increased, then heat dissipation efficiency is improved, but the substrate may lose its insulating properties
Solution Approach 1:
The patent applies different material properties to different regions: the polymer compound provides flexibility and insulation while thermally conductive fillers are strategically incorporated to create heat dissipation pathways, achieving localized thermal management without compromising overall insulating properties
Solution Approach 2:
The composite structure of polymer compound with thermally conductive fillers allows simultaneous achievement of thermal conductivity and electrical insulation, as the polymer matrix maintains insulating properties while the filler network provides thermal conduction pathways
3Temperature
If a heat dissipation member is added to address excessive heat, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing insulating substrate by forming an integrated structure where the polymer compound layer serves both as insulation and heat dissipation medium, eliminating the need for separate metal heat sinks and reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency and usability of input/output terminals, allowing for improved packaging miniaturization and reduced thermal stress on semiconductor devices, effectively addressing the excessive heat issues in semiconductor packages.
Implementation Method 1
a heat dissipation resin layer at least partially covering the plurality of semiconductor devices. The heat dissipation resin layer includes a thermally conductive polymer compound including a thermally conductive filler
Data Source
AI summary
A semiconductor package includes a flexible insulating substrate including a first surface and a second surface opposite to the first surface, a first wiring on the first surface of the flexible insulating substrate, a second wiring on the second surface of the flexible insulating substrate, a plurality of vias coupling the first wiring to the second wiring, a plurality of semiconductor devices on the first surface of the flexible insulating substrate, and a heat dissipation resin layer at least partially covering at least one semiconductor device of the plurality of semiconductor devices.