Semiconductor Cooling Jacket Layout for Uniform Module Temperatures
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Solution Overview
Problem
Conventional water-cooled power modules suffer from temperature variations among semiconductor elements due to high-temperature refrigerant being used for downstream elements, leading to uneven cooling, especially during high-load energization.
Innovation Solution
A semiconductor device design featuring a base plate with pin fins, multiple active elements, and a cooling jacket with a flow dividing wall and refrigerant introduction groove, which directs refrigerant flow to enhance cooling uniformity by increasing flow velocities and merging low-temperature refrigerant streams for effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If refrigerant flows sequentially through semiconductor elements from upstream to downstream, then the cooling structure is simple and easy to manufacture, but temperature variations among semiconductor elements increase and cooling uniformity deteriorates
Solution Approach 1:
The cooling jacket is divided into multiple independent cooling channels (first cooling channel, second cooling channel, third cooling channel) that are segmented to cool different groups of semiconductor elements. Each channel can be independently controlled to optimize cooling for specific regions, thereby reducing temperature variations while maintaining manufacturing simplicity.
Solution Approach 2:
Different cooling strategies are applied to different locations: the first cooling channel cools semiconductor elements in the first region, the second cooling channel cools elements in the second region, and the third cooling channel provides additional cooling. This local differentiation of cooling quality addresses temperature uniformity issues without requiring complete redesign of the entire cooling system.
2Productivity
If high-load energization is performed to increase power output, then productivity and power capability improve, but temperature variations among semiconductor elements become more pronounced and cooling effectiveness deteriorates
Solution Approach 1:
The multiple segmented cooling channels allow independent optimization of cooling capacity for each region under high-load conditions. Each channel can be designed with appropriate flow rates and cooling capacities to handle the thermal loads generated during high-power operation, preventing excessive temperature variations even when productivity is maximized.
Solution Approach 2:
The cooling system parameters (flow rate, channel configuration, thermal conductivity) are optimized to handle high-load conditions. By changing these parameters in the cooling design, the system can maintain temperature uniformity even when semiconductor elements operate at high power levels, thus allowing productivity improvement without sacrificing thermal management effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures uniform cooling of semiconductor elements by optimizing refrigerant flow velocities and temperatures, reducing thermal resistance and temperature variations, thereby improving the reliability of the semiconductor device.
Implementation Method 1
Refrigerant flows through the cooler. The plurality of semiconductor elements are cooled by the refrigerant flowing through the cooler.
Implementation Method 2
The pin fins are coupled to the second main surface. The cooling jacket has an opening. The pin fins are accommodated in the opening.
Implementation Method 3
a water-cooling jacket is deformed at a convex portion of a central portion of a circuit board. As a result, a flow path in a portion of the water-cooling jacket corresponding to the central portion of the circuit board is narrowed, and a flow velocity in the portion is increased accordingly
Implementation Method 4
The plurality of first active elements, the plurality of second active elements, and the passive element are disposed on the first main surface. The pin fins are coupled to the second main surface.
Data Source
AI summary
The plurality of first active elements, the plurality of second active elements, and the passive element are disposed in a first range, a second range, and a third range in the first direction, respectively. The third range is between the first range and the second range. Pin fins are accommodated in an opening of a cooling jacket. The opening has a first outlet and a second outlet at a downstream end in a second direction. The first outlet and the second outlet are disposed in the first range and the second range, respectively. The cooling jacket has a flow dividing wall at a downstream end in the second direction. The flow dividing wall is disposed in the third range. The cooling jacket has a refrigerant introduction groove on a bottom surface.