Semiconductor Package Reinforcement Structure for Crack and Warpage Control
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Solution Overview
Problem
Semiconductor packages are prone to cracks due to external impacts, mechanical damage, and thermal expansion/contraction, which can lead to personal injury and device failure, especially in the automotive field.
Innovation Solution
Incorporating a mechanical reinforcing member made of a material different from the molding member, positioned around the semiconductor chip within the molding member, to enhance the package's mechanical properties and prevent cracks, with specific material and physical properties selected to improve structural integrity and thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor packages are miniaturized to meet the trend of smaller electronic products, then the size, thickness, and weight of packages are reduced, but cracks may easily occur due to external impact and mechanical damage
Solution Approach 1:
The patent applies composite materials by combining the molding member (typically polymer-based) with a mechanical reinforcing member made of different material such as metal or ceramic. This composite structure provides both the lightweight, flexible properties of the polymer and the high strength, crack resistance of the reinforcing member, thereby resolving the contradiction between miniaturization and mechanical strength
Solution Approach 2:
The mechanical reinforcing member is strategically positioned around the semiconductor chip within the molding member, providing localized reinforcement exactly where stress concentration and crack initiation are most likely to occur during miniaturized package operation, rather than uniformly strengthening the entire package structure
2Volume of moving object
If semiconductor packages are miniaturized, then package size is reduced, but cracks may occur due to thermal expansion and contraction
Solution Approach 1:
The patent addresses thermal stability by carefully selecting materials with appropriate coefficients of thermal expansion and by optimizing the geometric parameters of the mechanical reinforcing member. The reinforcing member's material composition and dimensions are specifically chosen to compensate for thermal expansion and contraction stresses that occur during miniaturized package operation, maintaining structural stability across temperature variations
3Strength
If a mechanical reinforcing member is added to prevent cracks, then mechanical strength and reliability are improved, but device complexity increases
Solution Approach 1:
The patent merges the mechanical reinforcing member with the molding member into an integrated package structure. The reinforcing member is embedded within the molding material during the molding process itself, combining two functional elements (structural reinforcement and encapsulation) into a single manufacturing step, thereby reducing overall device complexity despite adding reinforcement functionality
Solution Approach 2:
The mechanical reinforcing member serves multiple functions simultaneously: it provides crack prevention, enhances mechanical strength, and maintains structural stability during thermal cycling. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving comprehensive mechanical protection
Data Source
AI summary
A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.