Semiconductor Package Solder Channel for Fine-Pitch Bump Isolation

Solution Overview

Problem

Current semiconductor packages face challenges in achieving stable and efficient electrical connections and physical support due to the complexity of fine-pitch bump arrangements and the risk of electrical shorts, especially in high-density and miniaturized electronic components.

Innovation Solution

The semiconductor packages incorporate a combination of first and second bumps with pillars and solder channels, where the second bumps have a solder channel on their side allowing the solder ball to extend, and are arranged in specific pitches to prevent electrical shorts and ensure equal heights, along with a passivation layer for protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If fine-pitch bump arrangements are used to increase density, then productivity and miniaturization are improved, but the risk of electrical shorts and manufacturing complexity increases

Engineering Contradiction:

ImprovedensityVSAvoidelectrical short risk

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The invention divides the bump structure into two distinct types: first bumps for electrical connection and second bumps for physical support only. This segmentation allows each bump type to be optimized independently, with second bumps positioned to provide support without creating electrical short circuits between adjacent pads, thereby enabling finer pitch arrangements while maintaining reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediary structure (the second bump with isolated electrical connection) that physically separates the electrical connection function from the support function. This intermediary element prevents direct electrical contact between adjacent pads while maintaining mechanical support, reducing electrical short risk in fine-pitch configurations.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If fine-pitch bump arrangements are used to increase density, then productivity and miniaturization are improved, but device complexity increases

Engineering Contradiction:

ImprovedensityVSAvoidbump arrangement complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The invention divides the bump structure into two distinct types: first bumps for electrical connection and second bumps for physical support only. This segmentation allows each bump type to be optimized independently, with second bumps positioned to provide support without creating electrical short circuits between adjacent pads, thereby enabling finer pitch arrangements while maintaining reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second bump structure serves multiple functions: it provides physical support to the semiconductor chip, maintains mechanical stability, and simultaneously acts as an electrical isolator. This multi-functionality reduces the need for separate support structures, simplifying the overall device design while enabling higher density.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Stability of the object's composition

If second bumps are added for physical support, then stability is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvephysical supportVSAvoidbump structure complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The invention merges the support function with the existing bump structure by making the second bumps electrically isolated versions of the connection bumps. This integration allows the support elements to be formed using the same manufacturing processes as the electrical bumps, reducing overall manufacturing complexity despite the increased structural functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The second bump structure serves multiple functions: it provides physical support to the semiconductor chip, maintains mechanical stability, and simultaneously acts as an electrical isolator. This multi-functionality reduces the need for separate support structures, simplifying the overall device design while enabling higher density.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8710657B2Semiconductor assembly and semiconductor package including a solder channel

Publication Date: 2014.04.29 SAMSUNG ELECTRONICS CO LTD

AI summary

Semiconductor packages connecting a semiconductor chip to an external device by bumps are provided. The semiconductor packages may include a connection pad on a semiconductor chip, a connecting bump on and configured to be electrically connected to the connection pad and a supporting bump on the semiconductor chip and configured to be electrically isolated from the connection pad. The connection bump may include a first pillar and a first solder ball and the supporting bump may include a second pillar and a second solder ball. The semiconductor packages may further include a solder channel in the second pillar configured to allow a portion of the second solder ball to extend into the solder channel along a predetermined direction.