Superconducting Interconnect Track With Kapitza Interfaces for Heat Blocking
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Solution Overview
Problem
Current methods for connecting electronic components in low-temperature applications, such as quantum computing and aerospace, fail to effectively limit heat flow while maintaining compactness, as they do not utilize the thermal insulation properties available at low temperatures.
Innovation Solution
A conductive track with high thermal resistance is achieved by forming a plurality of acoustic mismatch interfaces, using superconducting materials with significant differences in sound speed to create Kapitza interfaces, which efficiently reflect phonons and confine them within the track, thereby reducing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional connection methods are used to connect electronic components, then electrical connectivity is achieved, but thermal insulation is insufficient and heat flow between components is not effectively limited
Solution Approach 1:
The conductive track is divided into multiple sections made of different superconducting materials, creating multiple acoustic mismatch interfaces along the track. This segmentation approach transforms a single continuous thermal path into a series of discrete sections with high thermal resistance interfaces between them, effectively blocking heat flow while maintaining electrical connectivity.
Solution Approach 2:
The invention uses composite structures combining different superconducting materials (such as niobium, aluminum, tungsten, molybdenum) with distinct acoustic properties. These composite materials create acoustic mismatch interfaces where phonon transmission is strongly suppressed, achieving high thermal resistance while maintaining superconducting electrical conductivity at low temperatures.
2Loss of energy
If acoustic mismatch interfaces are added to reduce thermal conductivity, then thermal insulation improves, but device complexity increases
Solution Approach 1:
The conductive track is segmented into multiple sections of different superconducting materials, where each segment is relatively simple in structure. This segmentation allows the complex thermal insulation function to be achieved through a series of simple, repeatable units rather than a single complex structure, making the overall device more manufacturable.
Solution Approach 2:
The invention controls thermal conductivity by changing material parameters (acoustic velocity, density) rather than changing the geometric structure. By selecting superconducting materials with specific acoustic properties, the thermal resistance is controlled through material selection rather than complex structural design, simplifying the overall device architecture.
3Loss of energy
If materials with different acoustic properties are used to create acoustic mismatch interfaces, then phonon reflection increases and thermal resistance improves, but manufacturing precision requirements increase
Solution Approach 1:
The invention achieves high phonon reflection by changing material parameters (acoustic velocity, density) rather than relying on precise geometric interfaces. The acoustic mismatch between different superconducting materials creates strong phonon reflection even with standard fabrication tolerances, reducing the need for ultra-precise interface manufacturing.
Solution Approach 2:
The use of composite superconducting materials with inherently different acoustic properties creates robust acoustic mismatch interfaces. The material property differences themselves provide the thermal blocking function, making the interface precision requirements more forgiving compared to approaches relying on geometric features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient thermal insulation between electronic components, maintaining low thermal conductivity and compactness by optimizing the materials and number of acoustic mismatch interfaces, effectively controlling thermal conductance.
Implementation Method 1
this difference in speed induces a very efficient reflection of phonons at the interface
Implementation Method 2
each section being made of a superconducting material chosen so as to form with the section which follows it, if such a section exists, and the section which precedes it, if such a section exists, an acoustic mismatch interface (or Kapitza interface)
Implementation Method 3
For applications related to quantum computing and/or superconducting electronics, micro or nanoelectronic devices generally operate at very low temperatures
Implementation Method 4
thermal conductivity, ensured by phonons and electrons at 300 K, is mainly governed by electronic transport at very low temperatures
Data Source
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AI summary
One aspect of the invention relates to an electronic device (ED) comprising a first surface (S1) and a second surface (S2) opposite the first surface (S1) and intended to connect a first electronic component (EC1) to a second electronic component (EC2) located on the first surface (S1) by means of at least one conductive track (CT). The conductive track (CT) comprises a plurality of sections (STs) arranged one after the other to form the conductive track (CT). Each section (ST) is made of a superconducting material chosen to form, with the following section (ST), if such a section (ST), and the preceding section (ST), if such a section (ST), an acoustic mismatch interface (AI) (or Kapitza interface). The invention also relates to a first method and a second method for obtaining such a device.