Embedded Serializer SiP Camera Module for Compact Sensor Integration
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Solution Overview
Problem
Conventional camera modules for advanced driver assistance systems require miniaturization of camera components, leading to increased complexity and cost due to separate substrates for image sensors and serializers, which complicates assembly and increases the number of connection pads and bonding processes.
Innovation Solution
A System-in-Package (SiP) module is developed where the serializer is embedded within the substrate, electrically connected to the image sensor via a via hole, allowing for a single-layer or multi-layer substrate design with a heat dissipation pad, and using an adhesive member to secure the serializer between layers, simplifying the internal structure and eliminating the need for a flexible substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate substrates are used for image sensor and serializer, then electrical connection between them can be established, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent merges the image sensor and serializer onto a single substrate, eliminating the need for separate substrates and their associated connection interfaces. This integration reduces device complexity while maintaining electrical connection reliability through direct bonding or wiring on the same substrate.
Solution Approach 2:
The serializer is embedded within the substrate structure, with the substrate acting as a container that houses both the image sensor and serializer components. This nesting approach consolidates multiple functional elements into a unified structure, reducing overall complexity.
2Reliability
If multiple substrates and bonding processes are used, then electrical connection is achieved, but manufacturing cost and assembly complexity increase
Solution Approach 1:
By combining the image sensor and serializer fabrication into a single substrate manufacturing process, the patent eliminates multiple bonding steps and reduces assembly complexity. The electrical connection is established during substrate fabrication rather than through separate bonding operations.
3Volume of moving object
If camera module size is reduced, then miniaturization is achieved, but integration density must increase
Solution Approach 1:
The serializer is embedded within the substrate, utilizing the substrate's internal volume rather than requiring additional external space. This nesting enables miniaturization by consolidating components into the substrate's three-dimensional structure.
Solution Approach 2:
The patent transitions from a two-dimensional surface mounting approach to a three-dimensional embedded structure, allowing components to be positioned within the substrate volume. This dimensional change increases integration density and enables camera module miniaturization.
Data Source
AI summary
A SiP module according to the embodiment comprises: a substrate; an image sensor disposed on one surface of the substrate; and a serializer embedded inside the substrate. The substrate includes a via hole that penetrates through the substrate in order to electrically connect the image sensor and the serializer.