Preformed Mask EMI Shielding for Semiconductor Package Contacts
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Solution Overview
Problem
Traditional semiconductor package shielding methods completely cover the package, potentially short-circuiting exposed terminals and sockets, and require complex processes like tape masking, necessitating a need for selective electromagnetic interference (EMI) shielding.
Innovation Solution
The use of preformed masks to selectively form a shielding layer over semiconductor packages, allowing exposed components like connectors to remain unshielded while ensuring the shielding layer does not cover critical areas, using a process that includes sputtering metal deposition and reusable masks to streamline manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional shielding methods completely cover the package, then EMI shielding effectiveness is improved, but exposed terminals and sockets are short-circuited
Solution Approach 1:
The patent applies local quality by forming the shielding layer selectively only in specific regions of the package where EMI protection is needed, while leaving other regions (such as terminal areas) exposed. This is achieved through a multi-layer mask structure that provides different masking patterns for different areas, allowing the shielding layer to be deposited only where required rather than covering the entire package.
2Object-affected harmful factors
If tape masks are used to form partially shielded packages, then selective shielding is achieved, but the process complexity increases due to lamination and peeling steps
Solution Approach 1:
The patent applies preliminary action by pre-forming the mask structure before the shielding layer deposition process. The multi-layer mask is prepared in advance with the appropriate pattern, and then positioned on the package before introducing the shielding material. This eliminates the need for complex lamination and peeling steps required by tape masks, as the pre-formed mask structure is already in its final configuration before deposition begins.
3Object-affected harmful factors
If traditional shielding methods are used, then EMI protection is provided, but manufacturing costs increase due to complex processes
Solution Approach 1:
The patent applies universality by designing a mask structure that serves multiple functions simultaneously: it defines the shielding pattern, provides structural support during deposition, and can be reused for multiple packages. The multi-layer mask system can be configured for different shielding patterns by simply changing the mask assembly, eliminating the need for different masking solutions for different shielding requirements, thereby reducing overall manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective EMI shielding without short-circuiting exposed components, simplifies the manufacturing process, and reduces costs by allowing non-shielded components to be integrated during the same manufacturing stage, ensuring reliable electrical connections and reduced manufacturing complexity.
Implementation Method 1
a process that includes sputtering metal deposition
Data Source
AI summary
A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.