Embedded Vapor Chamber PCB Stack for Power Device Cooling
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Solution Overview
Problem
Conventional power control units (PCUs) face challenges in achieving high power density and efficient cooling due to their design, which results in high thermal resistance and power loss, especially at high switching frequencies, as they rely on surface-mounted power devices and external cooling systems that hinder direct thermal conduction.
Innovation Solution
The integration of vapor chambers within the PCB stack, thermally coupled to power devices and an external cooling system, enhances heat spreading and transfer by embedding vapor chambers directly within the substrate, reducing thermal resistance and enabling more efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power devices are surface-mounted on external cooling systems, then cooling capability is provided, but thermal resistance increases and power density decreases
Solution Approach 1:
The patent merges the power device, substrate, and vapor chamber into a single integrated structure. The power device is embedded directly within the substrate with the vapor chamber integrated inside, eliminating separate external cooling systems and reducing thermal resistance through direct thermal coupling.
Solution Approach 2:
The vapor chamber is nested within the substrate, which itself is embedded in the PCB stack. This nested arrangement allows the cooling function to be embedded within the structural layers, providing direct thermal management while maintaining compact dimensions.
2Ease of operation
If power cards extend distance from driver board with pin connections, then connectivity is achieved, but volume profile increases and power loss increases
Solution Approach 1:
The power device stack is merged directly into the PCB stack, eliminating the need for separate power cards that extend from the driver board. This integration reduces the overall volume profile while maintaining electrical connectivity through direct trace connections on the PCB.
3Temperature
If conventional external cooling systems are used, then cooling function is provided, but device complexity increases
Solution Approach 1:
The cooling function is merged into the substrate structure itself through the integrated vapor chamber. This eliminates the need for separate external cooling systems, pumps, and associated controls, thereby reducing overall system complexity while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach leads to improved power density, reduced thermal resistance, lower operating temperatures, and increased efficiency in heat removal from power devices, allowing for higher power handling and compact designs.
Implementation Method 1
a vapor chamber coupled to the power device stack, the vapor chamber being at least partially embedded within the PCB stack
Implementation Method 2
thermally coupled to the power devices and an external cooling system, enhances heat spreading and transfer
Data Source
AI summary
Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.