S-Cell Insulating Layer Assembly for Compact Power Electronics Cooling
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Solution Overview
Problem
Power electronic devices, particularly those using silicon-carbide, generate high heat flux and require effective cooling while maintaining a compact package size, which existing technologies struggle to achieve.
Innovation Solution
The integration of an S-cell within a circuit board assembly, comprising metal and graphite layers with an electrically insulating layer, allows for direct embedding of power electronics devices, eliminating the need for a separate electrical insulation layer between the circuit board and cold plate, enhancing thermal performance and reducing overall package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power electronic devices are made compact to reduce package size, then device footprint is reduced, but heat flux increases and cooling becomes more difficult
Solution Approach 1:
The patent combines the electrical insulation function and thermal conduction function into a single integrated layer. The electrically insulating layer is made of thermally conductive material, merging two previously separate functions (electrical insulation and heat dissipation) into one component, thereby reducing overall package size while maintaining effective cooling
Solution Approach 2:
The patent uses composite material structure with multiple layers including thermally conductive electrically insulating layers, graphite layers, and metal layers. This composite approach allows simultaneous achievement of electrical insulation, thermal conduction, and mechanical support in a compact configuration
2Reliability
If separate electrical insulation layers are added between circuit board and cold plate, then electrical insulation is improved, but thermal resistance increases and package size increases
Solution Approach 1:
The patent eliminates the need for separate electrical insulation layers by making the cold plate itself electrically insulating through the use of thermally conductive electrically insulating layers. This merging of insulation function into the thermal management structure removes the trade-off between electrical insulation and thermal conduction
Solution Approach 2:
The thermally conductive electrically insulating layer acts as an intermediary material that provides both electrical insulation and thermal conduction pathways. This mediator material replaces traditional separate insulation layers while maintaining thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces thermal resistance and package size while effectively managing heat flux, suitable for applications in electrified vehicles and other electronic systems.
Implementation Method 1
a first graphite layer bonded to the first metal layer... a second graphite layer bonded to the electrically insulating layer
Implementation Method 2
an electrically insulating layer bonded to the first graphite layer... bonded to the second graphite layer
Implementation Method 3
a cold plate and a circuit board assembly affixed to a first surface of the cold plate
Data Source
AI summary
Power electronics device assemblies, circuit board assemblies, and power electronics assemblies are disclosed. In one embodiment, a power electronics device assembly includes an S-cell including a first metal layer, a first graphite layer bonded to the first metal layer, an electrically insulating layer bonded to the first graphite layer, a second graphite layer bonded to the electrically insulating layer and a second metal layer bonded to the second graphite layer, the second metal layer comprising a surface and a recess provided within the surface. The power electronics device assembly further includes a power electronics device disposed within the recess of the surface.