Laminate RF Package Structure for High-Power Thermal and RF Loss Control
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Solution Overview
Problem
Conventional RF packages face challenges in handling high RF power due to high RF loss and poor thermal conductivity, which can lead to package failure and require costly and complex manufacturing processes.
Innovation Solution
A laminate RF package design featuring a carrier with a ring structure, an RF die, a heat spreader, and output-side leads, where the heat spreader is strategically positioned to reduce RF loss and enhance thermal conductivity, using materials like ceramic, aluminum oxide, or diamond to manage heat and signal transmission effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional RF packages are used to house semiconductor RF dies, then the package can protect the components from external damage, but the package exhibits high RF loss and poor thermal conductivity leading to trace heating and package failure
Solution Approach 1:
The patent employs a laminate structure combining multiple materials with complementary properties: a ceramic layer for low RF loss and high thermal conductivity, a metal layer for electrical connectivity and additional thermal management, and a polymer layer for structural support and cost-effectiveness. This composite approach resolves the contradiction by selecting materials that simultaneously achieve low RF loss and high thermal conductivity, preventing the trace heating that leads to package failure.
2Reliability
If conventional RF packages are used, then the package can protect the semiconductor RF dies, but the poor thermal conductivity causes heat generation and package failure
Solution Approach 1:
The laminate structure incorporates a ceramic layer known for high thermal conductivity to efficiently conduct heat away from the RF die, preventing excessive temperature rise. The metal layer provides additional thermal management pathways. This multi-material approach maintains package durability while controlling operating temperature through superior thermal conduction.
3Power
If high power handling is required, then more robust package materials and structures are needed, but this increases manufacturing complexity and cost
Solution Approach 1:
The package is divided into distinct functional layers (ceramic, metal, polymer) that can be manufactured separately using standardized processes and then assembled through lamination. This segmentation allows each layer to be optimized for its specific function while maintaining overall manufacturing simplicity and cost-effectiveness, enabling high power handling without excessive complexity.
Solution Approach 2:
The laminate structure combines materials that inherently provide high power handling capabilities: ceramic for thermal and RF performance, metal for electrical conductivity, and polymer for structural integrity. This material composition achieves robust power handling through material selection rather than complex structural designs, keeping manufacturing relatively simple.
4Ease of manufacture
If standard packages are used, then manufacturing is simpler, but the packages cannot handle high RF power effectively
Solution Approach 1:
The package uses a laminated structure with distinct layers that can be manufactured using conventional PCB and ceramic fabrication techniques, then assembled through standard lamination processes. This segmented approach maintains manufacturing simplicity while the specific material selection (ceramic with low RF loss) directly addresses the RF loss problem in standard packages.
Solution Approach 2:
By incorporating ceramic material into the laminate structure, the package achieves low RF loss properties without requiring entirely new manufacturing processes. The ceramic layer can be integrated using existing lamination technology, maintaining ease of manufacture while dramatically improving RF performance compared to standard plastic or metal packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate RF package effectively handles high RF power by reducing RF loss and heat generation, allowing for cooler operating temperatures and more efficient signal transmission while being cost-effective and customizable.
Implementation Method 1
The heat spreader is attached to a top surface of the ring structure... capable of being transmitted from the RF die to the output signal lead through the ring structure and the heat spreader
Implementation Method 2
If the package used for housing the semiconductor RF dies has high RF loss and/or poor thermal conductivity, trace heating may cause package failure
Data Source
AI summary
The present disclosure relates to a package capable of handling high radio frequency (RF) power, which includes a carrier, a ring structure attached to a top surface of the carrier, an RF die attached to the top surface of the carrier within an opening of the ring structure and electrically connected to the ring structure, a heat spreader attached to a top surface of the ring structure, and an output signal lead configured to send out RF output signals generated by the RF die. Herein, the heat spreader covers a portion of the top surface of the ring structure at an output side of the package, and the output signal lead is attached to a top surface of the heat spreader. As such, the RF output signals are capable of being transmitted from the RF die to the output signal lead through the ring structure and the heat spreader.