Semiconductor Package Structure With Carrier Openings for Multi-Chip WBGA
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Solution Overview
Problem
Current window ball-grid arrays (WBGA) package structures can only support a single electronic component, limiting their functional variety and increasing production costs due to the need for customized molds to prevent solder ball encapsulation.
Innovation Solution
A semiconductor package structure with a carrier having openings that allow bonding wires to connect electronic components on opposite sides, along with an electrical extension structure that alters the encapsulation process, enabling the use of a general mold and reducing thickness, thereby increasing functional variety and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single electronic component is supported in WBGA package structure, then the package structure can be manufactured with standard processes, but the functional variety is limited
Solution Approach 1:
The carrier is designed with multiple openings that can accommodate different electronic components (e.g., memory chips, logic chips, passive components) on opposite sides, enabling a single package structure to perform multiple functions. The electrical extension structure with protruding surface provides universal connectivity options for various component configurations.
Solution Approach 2:
The package structure is divided into distinct functional regions: the carrier with multiple openings for different components, bonding wires for electrical connections, and the electrical extension structure for external connectivity. This segmentation allows independent optimization of each component while maintaining overall functionality.
2Reliability
If customized mold is used to prevent solder ball encapsulation in WBGA package, then the encapsulation process can be optimized, but the production cost increases
Solution Approach 1:
Instead of using a customized mold to exclude solder balls from encapsulation, the invention inverts the approach by using a general mold that allows solder balls to be encapsulated along with the electrical extension structure. The electrical extension structure protrudes from the carrier surface, and the mold encapsulates both the carrier and this protruding structure together, eliminating the need for specialized mold designs.
Solution Approach 2:
A general-purpose mold is used that can encapsulate various WBGA package configurations without requiring customization. The mold is designed to accommodate the carrier and electrical extension structure in a standardized manner, making it reusable across different production batches and component types, thereby reducing tooling costs.
3Speed
If bonding wire is used to connect pad on die to substrate through window opening, then the conducting path length is reduced, but the package structure can only support single electronic component
Solution Approach 1:
The package structure transitions from a single-plane configuration to a three-dimensional arrangement with components on opposite sides of the carrier. The electrical extension structure protrudes from the carrier surface, creating additional spatial dimensions for component placement and electrical connection, enabling multi-component configurations while maintaining short signal paths.
Solution Approach 2:
The electrical connection system is segmented into multiple independent bonding wire paths, each connecting different components on opposite sides of the carrier to the electrical extension structure. This segmentation allows each signal path to remain short and optimized for speed while the overall structure supports multiple components with different functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the attachment of multiple electronic components on opposite sides of the carrier, reducing package thickness and increasing data transfer rates while simplifying the molding process and reducing production costs by eliminating the need for customized molds.
Implementation Method 1
The first bonding wire passes the first opening and has a first end bonded to the first electronic component and a second end bonded to the second electronic component
Implementation Method 2
The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure
Data Source
AI summary
An electronic package, a semiconductor package structure and a method for manufacturing the same are provided. The electronic package includes a carrier, a first electronic component, an electrical extension structure, and an encapsulant. The carrier has a first face and a second face opposite to the first face. The first electronic component is adjacent to the first face of the carrier. The electrical extension structure is adjacent to the first face of the carrier and defines a space with the carrier for accommodating the first electronic component, the electrical extension structure is configured to connect the carrier with an external electronic component. The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure.