Semiconductor Metal Holder for High Density I/O Alignment
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Solution Overview
Problem
Current semiconductor devices face challenges in miniaturization and increasing the number of electrical connections (I/Os) while maintaining reliable connections, as existing techniques often compromise on either miniaturization or connection density.
Innovation Solution
A semiconductor device design featuring a substrate with bonding pads and metal holders or elements that are strategically positioned and configured to enhance electrical connections, including the use of insulation layers and metal holders with cavities to reduce pitch between bonding pads and improve alignment, thereby increasing I/O density without compromising robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of electrical connections (I/Os) is increased, then connection density is improved, but the distance between connections cannot be sufficiently reduced
Solution Approach 1:
The patent introduces a vertical dimension by stacking multiple substrates (first substrate, second substrate, third substrate) to form a three-dimensional structure. This allows electrical connections to be established in both horizontal and vertical directions, effectively increasing connection density without proportionally reducing the horizontal distance between connections. The metal holder extends vertically to connect bonding pads across multiple substrate layers.
Solution Approach 2:
The patent employs a nested structure where the metal holder is positioned within a cavity formed in the insulation layer, and multiple substrates are stacked within a compact package structure. This nesting approach allows multiple bonding pads and connections to be accommodated in a reduced horizontal footprint, effectively increasing connection density while maintaining manageable connection distances.
2Quantity of substance
If bonding pads are placed closer together to increase I/O density, then connection density is improved, but alignment precision becomes more difficult to maintain
Solution Approach 1:
The patent introduces a metal holder as an intermediary component that provides mechanical support and positioning for bonding pads across multiple substrates. The holder's cavity structure acts as a precise template that guides the positioning of bonding pads, ensuring accurate alignment even when pads are placed closer together. This intermediary structure decouples the alignment requirement from the bonding pad spacing.
Solution Approach 2:
The patent performs preliminary positioning by first forming the cavity in the insulation layer and placing the metal holder within it before bonding the substrates. This preliminary action establishes a precise reference framework that guides subsequent bonding operations, ensuring that bonding pads are accurately aligned across multiple substrates even at reduced spacing.
3Volume of moving object
If miniaturization is pursued to reduce device dimensions, then device size is reduced, but the robustness of electrical connections may be compromised
Solution Approach 1:
The patent applies local quality by providing enhanced mechanical support and protection specifically at the bonding pad locations where electrical connections are made. The metal holder's cavity structure and positioning features provide localized reinforcement at critical connection points, ensuring robust electrical connections are maintained even as the overall device dimensions are reduced through miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a higher number of electrical connections with improved reliability and reduced risk of solder breakage and short circuits, while accommodating more bonding pads in a given area, thus enhancing miniaturization and connection density.
Implementation Method 1
bonding the two metal holder materials to the bonding pad
Data Source
AI summary
A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate and a metal holder. The substrate includes at least one bonding pad disposed adjacent to its surface and the metal holder is disposed adjacent to the bonding pad.