Carbon Nanotube Sheet Structure for Thermal Conductivity
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Solution Overview
Problem
Current thermal conductive sheets using carbon nanotubes do not adequately utilize their high thermal conductivity due to insufficient gap optimization between carbon nanotube bundles, leading to suboptimal heat radiation efficiency in electronic devices.
Innovation Solution
A sheet structure with carbon nanotube bundles arranged at specific gaps, filled with a supporting resin layer, where the bundles are either tapered or have exposed ends to enhance thermal conductivity and electrical conductivity, and a method of manufacturing involving catalytic metal films and controlled growth of carbon nanotubes with a filling material to maintain orientation and prevent configuration changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If carbon nanotube bundles are arranged with larger gaps to facilitate filling material insertion, then ease of manufacture is improved, but thermal conductivity decreases due to increased distance between bundles
Solution Approach 1:
The patent optimizes the gap size between carbon nanotube bundles as a critical parameter, setting it to a specific range (1-10 μm) that balances heat transfer efficiency with manufacturability. This parameter optimization ensures that the gap is small enough to maintain high thermal conductivity through effective heat transfer from the substrate while remaining large enough to allow filling material to be inserted and cured without excessive manufacturing complexity.
Solution Approach 2:
The patent creates different regions with different gap sizes: smaller gaps (1-10 μm) in regions where high thermal conductivity is prioritized, and larger gaps in regions where ease of manufacture is prioritized. This local differentiation allows the sheet structure to achieve high overall thermal conductivity while maintaining manufacturability in specific critical areas.
2Reliability
If carbon nanotube bundles are arranged with smaller gaps to enhance thermal conductivity, then heat radiation efficiency is improved, but manufacturing complexity increases due to difficulty in filling material insertion
Solution Approach 1:
The patent sets the gap size parameter within an optimal range (1-10 μm) that is small enough to ensure high thermal conductivity through effective heat transfer, yet large enough to allow filling material to be inserted using conventional manufacturing techniques. This parameter optimization resolves the contradiction between thermal performance and manufacturing complexity.
Solution Approach 2:
The patent applies partial action by forming filling material in only the necessary gaps between carbon nanotube bundles rather than filling the entire substrate area. This selective filling approach reduces manufacturing complexity while maintaining the thermal conductivity benefits of small gaps in the critical regions where heat transfer is most important.
3Ease of manufacture
If carbon nanotubes are dispersed in resin without bundle structure, then ease of manufacture is improved, but thermal conductivity is insufficient due to lack of oriented linear structure
Solution Approach 1:
The patent segments the carbon nanotube structure into bundled configurations rather than using fully dispersed individual nanotubes. This segmentation creates oriented linear structures that provide high thermal conductivity pathways while still allowing the bundles to be integrated into a resin matrix, thus maintaining a balance between ease of manufacture and thermal performance.
Solution Approach 2:
The patent creates a composite structure combining carbon nanotube bundles with resin matrix, where the bundles provide the oriented linear structure necessary for high thermal conductivity while the resin provides ease of manufacture and structural support. This composite approach leverages the strengths of both dispersed and bundled configurations.
4Ease of operation
If substrate is removed after carbon nanotube growth, then ease of operation is improved by direct contact, but structural stability decreases without substrate support
Solution Approach 1:
The patent uses the filling material as an intermediary substance that is inserted between the carbon nanotube bundles and the substrate. This filling material maintains the spatial configuration and orientation of the carbon nanotube bundles while allowing the substrate to be removed, thus providing both structural stability and enabling direct contact with heat sources after removal.
Solution Approach 2:
The patent performs preliminary action by inserting and curing the filling material before removing the substrate. This preliminary insertion of the filling material provides structural support to the carbon nanotube bundles during the substrate removal process and maintains their configuration stability afterward, enabling direct contact with heat sources without compromising structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized gap and configuration of carbon nanotube bundles significantly increase thermal and electrical conductivity, improving heat radiation efficiency and reliability in electronic instruments by ensuring direct contact with heat sources and radiators.
Implementation Method 1
forming a catalytic metal film in a plurality of regions of a substrate, which are spaced from each other; forming a plurality of linear structure bundles having a plurality of linear structures of carbon atoms in the respective plurality of regions by growing liner structures of carbon atoms with the catalytic metal film as a catalyst
Data Source
AI summary
The sheet structure includes a plurality of linear structure bundles 12 each of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and which are arranged at a second gap which is larger than the first gap; and a filling layer 14 filled in the first gap and the second gap and supporting the plurality of linear structure bundles 12.