Semiconductor Package Cavity Structure for Thin Protected Mounting
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Solution Overview
Problem
Semiconductor device packages face challenges in reducing area footprint while maintaining performance, as mounting components on both surfaces increases area and stacking increases thickness, hindering connection to circuit boards.
Innovation Solution
A semiconductor device package design featuring a substrate with a cavity for internal components and a package body covering external components, along with a shield for electromagnetic interference protection, allows for reduced thickness and increased distance from the circuit board, enabling flexible contact selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are mounted on both top surface and bottom surface of substrate, then functionality and performance are increased, but area footprint increases
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional vertical stacking by forming a cavity within the substrate that extends from the bottom surface toward the top surface. Electronic components are positioned within this cavity and on the top surface, utilizing the vertical dimension (thickness) to accommodate multiple components without increasing the horizontal footprint area.
2Area of stationary object
If electronic components are arranged in stacking arrangement, then area footprint is reduced, but package thickness increases
Solution Approach 1:
The substrate is segmented into multiple functional regions: a top surface for mounting components, a bottom surface with a cavity extending inward, and sidewalls forming the cavity boundaries. This segmentation allows different components to be positioned in different spatial zones (some on top surface, some within cavity), optimizing both footprint and thickness by distributing components across available three-dimensional space rather than forcing uniform stacking.
3Ease of operation
If package thickness is reduced to enable circuit board connection, then connectivity is improved, but component protection and spacing are compromised
Solution Approach 1:
The cavity structure acts as a nested configuration where the substrate contains an internal void space that houses electronic components. This nesting provides protective enclosure for sensitive components while maintaining overall compact dimensions. The cavity walls provide physical protection and electrical isolation, allowing the package to achieve reduced external thickness for better circuit board connectivity while internally maintaining adequate component spacing and protection.
Data Source
AI summary
A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.