Electronic Module Routing via Passivation-Surface Conducting Patterns
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Solution Overview
Problem
Existing electronic module technologies face challenges in achieving high routing efficiency while maintaining cost-effectiveness, particularly when increasing the number of component contacts and narrowing the pitch between contact lands or bumps.
Innovation Solution
The introduction of an additional passivation layer on the component's surface with a conducting pattern spaced apart from contact terminals, allowing for electrical connections through secondary contact elements, which can function as redistribution lines or electromagnetic interference shields without adding additional wiring layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If additional wiring layers are added to increase routing capabilities, then routing efficiency is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent utilizes the component's first surface (top surface) as an additional routing dimension by placing conducting patterns on the additional passivation layer. This allows routing to occur in the vertical dimension (on the component surface) rather than only in horizontal wiring layers, effectively adding a new dimension for signal distribution without increasing the number of wiring layers.
Solution Approach 2:
The conducting patterns on the additional passivation layer serve multiple functions: they act as redistribution lines for routing signals, electromagnetic interference shields to protect sensitive circuits, and can be spaced apart to provide isolation. This multi-functionality eliminates the need for separate dedicated shielding layers or additional wiring layers.
2Adaptability or versatility
If the number of component contacts is increased to improve routing options, then routing flexibility is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the routing function into two parts: contact terminals that connect to the component and conducting patterns on the additional passivation layer that perform redistribution and shielding. The conducting patterns are spaced apart from the contact terminals, creating distinct functional zones that can be manufactured independently with relaxed precision requirements compared to densely packed contacts.
3Productivity
If conducting patterns are placed closer to contact terminals to improve routing density, then routing efficiency is improved, but electrochemical migration risk increases
Solution Approach 1:
The additional passivation layer acts as an intermediary barrier between the conducting patterns and the contact terminals. By placing the conducting patterns on this additional passivation layer and spacing them apart from the contact terminals, the patent creates a physical and electrical isolation layer that prevents direct interaction, thereby reducing electrochemical migration risk while maintaining routing density.
Data Source
AI summary
Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer (3), a component (1) having a surface with contact terminals (2) and first contact elements (6) that connect at least some of the contact terminals (2) to the wiring layer (3). The electronic module is provided with at least one conducting pattern (4) on the surface of the component (1) but spaced apart from the contact terminals (2). The electronic module further comprises a dielectric (5) and at least one second contact element (7) that connects the conducting pattern (4) to the wiring layer (3) through a portion of said dielectric (5). Methods of manufacturing such modules are also disclosed.An electronic module including a first wiring layer, a dielectric supporting the first wiring layer, wherein the first wiring layer is embedded in the dielectric, a component having a first surface and at least one contact terminal on the first surface, an additional passivation layer on the first surface of the component and in contact with the dielectric, a conducting pattern on the additional passivation layer on the first surface of the component and spaced apart from each of the at least one contact terminal, at least one first contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the at least one contact terminal, and at least one second contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the conducting pattern.