Dually-Curable Resin Composition for Rapid Curing and Shadow Area Adhesion
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Solution Overview
Problem
Room temperature curable silicone compositions cure slowly and exhibit cohesive failure when removed from substrates, while photo curable silicone compositions cure quickly but poorly in shadow areas, lacking comprehensive adhesion and releasability.
Innovation Solution
A dually-curable resin composition comprising a first polyorganosiloxane with alkenyl and alkoxy groups, a second polyorganosiloxane with photoreactive functional groups, a silane compound, a photoinitiator, and a condensation reaction catalyst, which allows for rapid photo curing and excellent curability in shadow areas, achieving high hardness and adhesion with releasability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If room temperature curable silicone composition is used, then no separate heating process is required for curing, but it takes a long time until curing completely
Solution Approach 1:
The patent combines two different curing mechanisms (moisture curing and photo curing) into a single dual-curable resin composition. The composition contains both condensation-curable functional groups (alkoxysilane groups that react with moisture) and photopolymerizable functional groups (vinyl, allyl, or other unsaturated groups that react with UV light). This allows the material to benefit from both curing methods simultaneously, achieving rapid initial curing through photo polymerization while completing the curing process through moisture-induced condensation, thereby resolving the contradiction between ease of manufacture and curing speed.
2Productivity
If photo curable silicone composition is used, then very high reaction rate is achieved, but poor curability in shadow area occurs
Solution Approach 1:
The patent changes the chemical parameters of the resin composition by incorporating dual-curable functional groups with different reaction mechanisms. The photopolymerizable groups (vinyl, allyl) provide rapid curing where UV light reaches, while the condensation-curable groups (alkoxysilane) continue to react with moisture in the absence of light. This parameter change in the chemical composition allows the material to adapt its curing behavior to different environmental conditions, ensuring complete curing throughout the entire composition including shadow areas.
3Strength
If room temperature curable silicone composition is used, then good adhesion to substrate is achieved, but cohesive failure occurs when cured body is removed from substrate
Solution Approach 1:
The patent introduces dynamic controllability into the adhesion characteristics through dual-curable functionality. By using both moisture-curable and photo-curable mechanisms, the curing process can be controlled in stages. The photo-curable portion provides rapid initial adhesion that can be adjusted by controlling UV exposure, while the moisture-curable portion provides ongoing adhesion development. This dynamic curing control allows optimization of the balance between adhesion strength and releasability, as the curing can be stopped or modified at different stages to achieve the desired level of bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dually-curable resin composition enables quick curing, high hardness, and excellent adhesion and releasability, enhancing repairability and re-workability in electronic devices by ensuring rapid initial curing and complete curing in shadow areas.
Implementation Method 1
photo curable silicone composition exhibits a very high reaction rate due to radical polymerization by UV-Vis light
Implementation Method 2
room temperature vulcanizing (RTV) silicone which can be cured by moisture in air at room temperature
Data Source
AI summary
A dually curable resin composition is provided. The composition comprises: (A) a first polyorganosiloxane comprising at least one alkenyl group and at least one alkoxy group in one molecule; (B) a second polyorganosiloxane comprising at least two photoreactive functional groups in one molecule on its side chain of siloxane backbone; (C) at least one silane compound represented by a particular chemical formula herein or its partially hydrolyzed compound; (D) at least one photoinitiator; and (E) at least one condensation reaction catalyst. A cured body prepared by curing the dually curable resin composition, and an electronic device comprising the cured body, are also provided.