Automated 3D Substrate Mounting Alignment via Optical Measurement
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Solution Overview
Problem
Existing mounting devices for three-dimensional substrates are cumbersome due to the need for manual teaching processing, which involves using a camera to adjust the mounting head based on the curvature of the substrate, leading to inefficiencies and inaccuracies.
Innovation Solution
A mounting device that includes a stage for supporting the three-dimensional substrate, a mounting head for attaching components, and a system for acquiring and comparing measurement data with design data to calculate the necessary rotation angles for horizontal alignment of the substrate, allowing for automated control of the stage and mounting head.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual teaching processing is performed using a camera to adjust the mounting head based on substrate curvature, then mounting position accuracy can be achieved, but the device complexity and operation time increase significantly
Solution Approach 1:
The patent replaces the manual mechanical adjustment process with an automated optical measurement and calculation system. A 3D measurement device captures substrate surface data, and a control device automatically calculates mounting head adjustment amounts based on the measured curvature, eliminating the need for manual camera-based teaching processing while maintaining mounting position accuracy.
Solution Approach 2:
The system performs self-alignment by automatically measuring the substrate curvature and calculating the necessary mounting head adjustments without human intervention. The control device uses the measured 3D surface data to determine adjustment amounts, enabling the system to self-correct for substrate variations without requiring manual teaching operations.
2Manufacturing precision
If manual teaching processing is performed point by point using a camera, then mounting position can be adjusted, but productivity decreases due to time-consuming operations
Solution Approach 1:
The patent performs preliminary 3D measurement of the entire substrate surface before mounting operations begin. By capturing the complete surface topology in advance and pre-calculating all necessary mounting head adjustments, the system eliminates time-consuming point-by-point teaching operations during actual production, significantly improving productivity while maintaining precision.
Solution Approach 2:
The automated optical measurement and computational system replaces the slow manual camera-based teaching process. The control device rapidly processes 3D measurement data to determine mounting head adjustments, performing the task in a fraction of the time required for manual point-by-point adjustment, thereby dramatically increasing teaching processing efficiency.
3Manufacturing precision
If a camera is used for teaching processing based on substrate curvature, then mounting position can be controlled, but the operation process becomes cumbersome and complex
Solution Approach 1:
The patent replaces the complex manual camera-based teaching operation with an automated system that uses a 3D measurement device and control device. The control device automatically processes the measured substrate surface data and calculates mounting head adjustments, eliminating the need for operators to manually perform complex teaching operations while maintaining precise mounting position control.
Solution Approach 2:
The system performs self-alignment and self-adjustment by automatically measuring substrate curvature and calculating the necessary mounting head corrections. This eliminates the need for operator intervention in the teaching process, making the operation simpler and more straightforward while maintaining the ability to control mounting positions accurately.
Data Source
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AI summary
A mounting device including a stage, a mounting head, a measurement data acquisition unit, a data comparison unit that compares design data and measurement data of a surface of a three-dimensional substrate and extracts a mounting position in the measurement data, a substrate data calculation unit that calculates substrate data including a rotation angle for horizontally aligning the surface at the mounting position based on a difference in coordinates between the design data and the measurement data, a stage control unit that controls the stage to horizontally align the surface of the three-dimensional substrate at the mounting position based on the substrate data, and a head control unit that controls the mounting head so that the component is mounted at the mounting position while the surface of the three-dimensional substrate at the mounting position is horizontally aligned.